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首页> 外文会议>Asian Pacific conference for fracture and strength'99 (APCFS'99) >A STUDY ON THE DEVELOPMENT OF DYNAMIC PHOTOELASTIC HYBRID METHOD FOR THE FRACTURE MECHANICS OF BIMATERIAL (ISOTROPIC/ISOTROPIC) CONSIDERING RESIDUAL STRESS
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A STUDY ON THE DEVELOPMENT OF DYNAMIC PHOTOELASTIC HYBRID METHOD FOR THE FRACTURE MECHANICS OF BIMATERIAL (ISOTROPIC/ISOTROPIC) CONSIDERING RESIDUAL STRESS

机译：考虑残余应力的双稳态（等向/等向）断裂力学的动态光弹混合方法研究

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摘要

When the interfacial crack of isotropicrnmaterial/isotropic material is propagated with constantrnvelocity along the interface, stress and displacementrncomponents are derived in this research. The dynamicrnphotoelastic experimental hybrid method for bimaterial isrnintroduced. Dynamic biaxial loading device is developed,rnits strain rate is 31.637 s~(-1) and its maximum impact loadrnis 20 ton. The simplified split-Hopkinson pressure barrndevice for the measurement of dynamic physicalrnproperties and stress fringe values is developed andrnmanufactured. Using this device, we can measurerndynamic stress fringe values and physical properties.rnManufactured method for model of the dynamicrnphotoelastic experiment for isotropic material/isotropicrnmaterial bimaterial is suggested. They are bondingrnmethod(bonding material: AW106, PC-1) and moldingrnmethod. In the bonding method, residual stress is notrnoccurred in the manufactured bimaterial. Crack isrnpropagated along the interface or sometimes deviatedrnfrom the interface. While in the molding method, residualrnstress is occurred in the manufactured bimaterial. Crackrnis always deviated from the interface and propagated inrnthe epoxy region. Therefore, we should develop anotherrntheory for the stress and displacement components tornanalyze the stress distribution of the bimaterialrnmanufactured by molding method.
机译：当各向同性材料/各向同性材料的界面裂纹沿界面以恒定的速度传播时，应力和位移分量被导出。介绍了双材料的动态光弹实验混合方法。开发了动态双轴加载装置，其应变速率为31.637 s〜（-1），最大冲击载荷为20吨。开发并制造了用于测量动态物理性质和应力条纹值的简化的分体式霍普金森压力巴恩装置。利用该装置，可以测量动应力条纹值和物理性能。提出了各向同性材料/各向同性材料双材料动态光弹性实验模型的制造方法。它们是粘合方法（粘合材料：AW106，PC-1）和成型方法。在粘结方法中，在制造的双材料中不会产生残余应力。裂纹沿界面传播，有时甚至偏离界面。在模制方法中，在制造的双材料中会出现残余应力。饼干总是偏离界面并在环氧区域中扩散。因此，我们应该为应力和位移分量开发另一种理论，以分析通过成型方法制造的双材料的应力分布。

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