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Dynamic Fatigue and a Subcritical Crack Growth Model for Si_3N_4 Material

机译:Si_3N_4材料的动态疲劳和亚临界裂纹扩展模型

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Dynamic fatigue tests on one kind of Si3N4 material were carried out in air at room temperature. Thernexperimental results showed that in the low stress rate region, the relation between the stress rate (V) andrnthe mean value of the failure stress( σ_f ) was a straight line in a log-log representation, and at a high stress rate ,the relation between them seriously deviated from the straight line . On the basis of the experimentalrnresults, a subcritical crack growth model based on the R-curve concept was developed to explain therndynamic fatigue behaviour.
机译:在室温下于空气中对一种Si3N4材料进行了动态疲劳测试。实验结果表明,在低应力率区域,应力率(V)与破坏应力的平均值(σ_f)之间的关系为对数对数表示的直线,而在高应力率下,该关系他们之间严重偏离了直线。在实验结果的基础上,建立了基于R曲线概念的亚临界裂纹扩展模型,以解释其动态疲劳行为。

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