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首页> 外文会议>Asian Pacific conference for fracture and strength'99 (APCFS'99) >Influence of Bonding Condition on Joint Strength of Si_3N_4/Si_3N_4 Bonding
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Influence of Bonding Condition on Joint Strength of Si_3N_4/Si_3N_4 Bonding

机译：结合条件对Si_3N_4 / Si_3N_4结合强度的影响

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The liquid –phase bonding of silicon nitride ceramics was performed using Y_2O_3-rn-Al_2O_3-SiO_2 glass solder. The bonding was carried out in pure N2 gas without applied pressure, and thernbonding conditions were at 1723,1773,1823,1873 and 1923K for 0.9ks,and at 1823K for 0.6,0.9,1.8 andrn2.7ks,to determine the effects of bonding temperature and holding time on the bonding strength. The jointrnstrength was measured by four-point bending test. The interface microstructures and fractured surfacesrnafter testing were observed by scanning electron microscopy (SEM).The thermal residual stressrndistributions in joints with varying joint thickness were determined by the finite elementrnanalysis(FEA),which affected the joint strength and fracture surface. It was shown that the bondingrntemperature and holding time had a strong influence on the joint strength. With increase of bondingrntemperature and holding time, the joint strength first increased, reaching a peak ,and then decreasedrnremarkably . According to microanalyses, the bonding strength was mainly controlled by joint thickness,rnwhich was affected by bonding temperature and holding time. The maximum bonding strength ofrn315Mpa was obtained under a suitable conditions, and the joint thickness was 40mm. Based on the resultsrnof FEA, the axial stresses(sxx)became compressive from tensile at the ceramics near the interface, whilernit became tensile from compressive near the midplane with increase of joint thickness, which affected thernbonding strength and fracture type.
机译：氮化硅陶瓷的液相键合是使用Y_2O_3-rn-Al_2O_3-SiO_2玻璃焊料进行的。在没有施加压力的纯氮气中进行键合，键合条件分别在1723、1773、1823、1873和1923K下进行0.9ks，在1823K下分别进行0.6、0.9、1.8和2.7kks，以确定键合效果温度和保温时间对粘接强度的影响。接头强度通过四点弯曲试验测量。扫描电镜观察了试验后的界面组织和断裂面。通过有限元分析确定了不同厚度的接头的热残余应力分布，影响了接头的强度和断裂面。结果表明，粘接温度和保温时间对接头强度有很大影响。随着粘接温度和保温时间的增加，接头强度先增大，达到峰值，然后明显下降。微观分析表明，结合强度主要受接缝厚度的控制，受接缝温度和保温时间的影响。在合适的条件下获得了最大的结合强度rn315Mpa，接头厚度为40mm。基于有限元分析的结果，轴向应力（sxx）在界面附近的陶瓷处因拉伸而压缩，而随着连接处厚度的增加，在中平面附近因压缩而由拉伸变为拉伸，这影响了粘结强度和断裂类型。

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