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首页> 外文会议>ASME(American Society of Mechanical Engineers) International Mechanical Engineering Congress: Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology; 20031115-20031121; Washington,DC; US >MOLECULAR DYNAMICS SIMULATIONS OF NANOTUBE-POLYMER COMPOSITES FOR USE AS THERMAL INTERFACE MATERIAL
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MOLECULAR DYNAMICS SIMULATIONS OF NANOTUBE-POLYMER COMPOSITES FOR USE AS THERMAL INTERFACE MATERIAL

机译：用作热界面材料的纳米管-聚合物复合材料的分子动力学模拟

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摘要

Thermal management in microelectronics is an important issue due to the projected increase in power dissipation in the electronic devices over the next 5-10 years. We seek a solution to this problem by exploring carbon nanotube-polymer matrix composites for use as thermal interface materials because of the reported high thermal conductivity and other remarkable thermal and mechanical properties of nanotubes. As an intermediate step to finding the composites' conductivity, it is important to validate the use carbon nanotubes by calculating its diffusivity and conductivity first. This would facilitate later the estimating of important design parameters for thermal interface materials such as thermal diffusivity and conductivity. As polymer molecules are on the same size scale as nanotubes and the interaction at the polymeranotube interface is highly dependent on the molecular structure and bonding, Molecular Dynamic (MD) simulation is used to estimate the nano-scale properties. In this paper, unit cell model consisting of a carbon nanotube was used and the diffusivity was measured. These findings would have implications in improving the thermal management efficiency and consequently improve the performance and reliability of future microelectronic devices.
机译：由于预计未来5-10年电子设备的功耗会增加，因此微电子的热管理成为一个重要问题。由于报道了碳纳米管的高导热性以及其他显着的热和机械性能，我们通过探索用作热界面材料的碳纳米管-聚合物基复合材料来寻求解决此问题的方法。作为找到复合材料电导率的中间步骤，重要的是通过首先计算其扩散率和电导率来验证使用的碳纳米管。这将有助于以后估算热界面材料的重要设计参数，例如热扩散率和导热率。由于聚合物分子的大小与纳米管相同，并且聚合物/纳米管界面上的相互作用高度依赖于分子结构和键合，因此使用分子动力学（MD）模拟来估算纳米级特性。在本文中，使用了由碳纳米管组成的晶胞模型，并测量了扩散率。这些发现将对提高热管理效率具有意义，并因此提高未来微电子器件的性能和可靠性。

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