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首页> 外文会议>ASME International Conference on Nanochannels, Microchannels, and Minichannels >High Heat Flux Dissipation Using Symmetric Dual-Taper Manifold in Pool Boiling
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High Heat Flux Dissipation Using Symmetric Dual-Taper Manifold in Pool Boiling

机译：对称双锥流形在池沸腾中的高通量散热

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The trend of miniaturization in electronics presents a great challenge in the thermal management of devices. The continuous increase in the number of transistors in the processor leads to high heat flux generation, limiting the performance of the device. Boiling heat transfer offers a great heat removal competency while maintaining the low chip temperatures. The critical heat flux (CHF) dictates the maximum heat removal ability, and heat transfer coefficient (HTC) defines the efficiency of the boiling process. This pool boiling study is focused on using a manifold containing a symmetric dual taper over the heating surface. The heat transfer performance of this configuration is evaluated for different taper angles in the manifold. The macro-convection assisted by vapor columns during boiling enhance the CHF and HTC limit significantly. A CHF of 287 W/cm~2 with an HTC of 116 kW/cm~(2o)C was achieved with a plain copper surface, representing greater than a 2-fold increases in each over a plain surface.
机译：电子设备的小型化趋势对设备的热管理提出了巨大的挑战。处理器中晶体管数量的不断增加导致高热通量的产生，从而限制了设备的性能。沸腾传热提供了出色的排热能力，同时保持了较低的切屑温度。临界热通量（CHF）决定了最大的除热能力，而传热系数（HTC）则定义了沸腾过程的效率。该池沸腾研究的重点是在加热表面上使用一个包含对称双锥度的歧管。针对歧管中不同的锥角评估了此配置的传热性能。沸腾过程中由蒸气柱辅助的大对流显着提高了CHF和HTC的限值。在纯铜表面上可实现287 W / cm〜2的CHF和116 kW / cm〜（2o）C的HTC，在整个纯铜表面上，其CHF均大于2倍。

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