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STUDY OF THE MECHANICS OF THE MICRO-GROOVE CUTTING PROCESS

机译:微槽切削过程机理的研究

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In an earlier paper, a high-speed micro-groove cutting process that makes use of a flexible single-point cutting tool was presented. In this paper, 3D finite element modeling of this cutting process is used to better understand process mechanics. The development of the model, including parameter estimation and validation, is described. Validation experiments show that on average the model predicts side bun-height to within 2.8%, chip curl radius to within 4.1%, and chip thickness to within 25.4%. The model is used to examine chip formation, side burr formation, exit burr formation, and the potential for delamination of a workpiece consisting of a thin film on a substrate. Side burr formation is shown to primarily occur ahead of a tool and is caused by expansion of material compressed after starting to flow around a tool rather than becoming part of a chip. Exit burr formation is shown to occur when a thin membrane of material forms ahead of a tool and splits into two side segments and one bottom segment as the tool exits a workpiece. Lastly, examination of the stresses below a workpiece surface shows that film delamination can occur when the depth of a groove cut into a thin film is large relative to the film thickness.
机译:在较早的论文中,提出了一种使用灵活的单点切削工具的高速微槽切削工艺。在本文中,此切削过程的3D有限元建模用于更好地理解过程力学。描述了模型的开发,包括参数估计和验证。验证实验表明,平均而言,该模型可预测侧面bun头高度在2.8%之内,切屑卷曲半径在4.1%之内,切屑厚度在25.4%之内。该模型用于检查切屑形成,侧面毛刺形成,出口毛刺形成以及由基板上的薄膜组成的工件分层的可能性。侧面毛刺的形成主要发生在刀具之前,并且是由于在开始围绕刀具流动而不是成为切屑的一部分之后被压缩的材料膨胀而引起的。如图所示,当在刀具前方形成一层薄薄的材料膜并在刀具离开工件时分裂为两个侧段和一个底部段时,就会形成出口毛刺。最后,检查工件表面下方的应力表明,当切入薄膜的凹槽深度相对于薄膜厚度较大时,会发生薄膜分层。

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