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The Development of a Design Procedure and Usage Criteria for Hot Applied Chip Seal Applications

机译:热应用芯片密封应用的设计程序和使用标准的发展

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This paper will discuss the various hot applied and highly modified field blended hinder materials that are currently being manufactured in the United States and utilized in chip and cape seal pavement preservation applications. These pavement preservation systems serve as alternatives to expensive construction or re-construction techniques. Further discussion will focus on a specific chip seal design method which includes binder design and aggregate retention testing to determine materials compatibility prior to a project being constructed Binder and aggregate application rates, proper aggregate quality and gradation, along with other construction issues and procedures; including traffic volume and climatic region are variables that will also be considered as part of this "design "process.
机译:本文将讨论目前在美国制造并用于碎石和海角密封路面保存应用的各种热应用和高度改性的现场混合后阻材料。这些路面养护系统可替代昂贵的建筑或重建技术。进一步的讨论将集中在一种特定的芯片密封设计方法上,该方法包括粘合剂设计和骨料保留测试,以确定在建设项目之前的材料兼容性。粘合剂和骨料的施用率,适当的骨料质量和等级以及其他施工问题和程序;包括流量和气候区域在内的变量都是变量,也将被视为此“设计”过程的一部分。

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