Low-Temperature Wafer-Scale 'WARM' Embossing for Mix Match with UV-Lithography

机译：低温晶圆级'WARM'压印，可与UV平版印刷混合使用

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The combination of nanoimprint (hot embossing) and UV-lithography has been demonstrated. For this purpose an UV-sensitive epoxy based resin (mr-L 6000-1 xp) with a low glass temperature (T_g) was prepared by adding low molecular weight components, in particular by increasing the monomer content. The suitability of our approach to minimise process temperatures was tested by embossing and UV-lithography. Mix and match of both techniques was used to demonstrate that the embossing step did not degrade the UV sensitivity of the material. UV processing provided in addition a simple means for stabilisation of this low T_g material. Resists like mr-L 6000-1 xp may close the gap between "hot embossing", "UV-molding" and UV-lithography.

机译：纳米压印（热压花）和紫外光刻技术的结合已得到证明。为此目的，通过添加低分子量组分，特别是通过增加单体含量，制备了具有低玻璃温度（T_g）的紫外线敏感的环氧基树脂（mr-L 6000-1 xp）。通过压印和UV光刻测试了我们使工艺温度降至最低的方法的适用性。两种技术的混合和匹配用于证明压花步骤不会降低材料的紫外线敏感性。紫外线处理另外提供了一种稳定这种低T_g材料的简单方法。诸如mr-L 6000-1 xp之类的抗蚀剂可能会缩小“热压花”，“ UV成型”和UV光刻之间的差距。

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来源
《Conference on Emerging Lithographic Technologies VI Pt.1, Mar 5-7, 2002, Santa Clara, USA》|2002年|p.223-231|共9页
会议地点 Santa Clara CA(US)
作者
Hubert Schulz; Matthias Wissen; Nils Roos; Hella-Christin Scheer; Karl Pfeiffer; Gabi Gruetzner;
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作者单位

University of Wuppertal, Microstructure Engineering, Fuhlrottstr. 10, D-42119 Wuppertal, Germany;

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会议组织
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词
nanoimprint lithography; UV lithography; mix and match; low temperature embossing; wafer scale;

机译：纳米压印光刻；紫外光刻；连连看;低温压花；晶圆规模;

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Low-Temperature Wafer-Scale 'WARM' Embossing for Mix Match with UV-Lithography

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