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首页> 外文会议>Conference on Emerging Lithographic Technologies VI Pt.1, Mar 5-7, 2002, Santa Clara, USA >Fabrication Challenges for Next Generation Devices: MEMS for RF Wireless Communications
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Fabrication Challenges for Next Generation Devices: MEMS for RF Wireless Communications

机译：下一代设备的制造挑战：用于射频无线通信的MEMS

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摘要

With wireless communications becoming an important technology and growth engine for the semiconductor industry, many semiconductor companies are developing technologies that differentiate themselves in this space. One means of accomplishing this goal is to find a way to integrate passive components, which currently make up over 70% of the discrete components in a wireless handset today, directly on-chip thereby greatly simplifying handsets. While a number of technologies are being investigated to allow on-chip integration, microelectromechanical systems (MEMS) technologies are an important part of this development effort. They have been used to create switches, filters, local oscillators, variable capacitors and high quality factor inductors to name a few examples. The lithography requirements for these devices are very different than those found in standard semiconductor fabrication with the most important involving patterning over extreme topography. In this paper, we discuss some of the fabrication challenges for these devices as well as some approaches that have been demonstrated to satisfy them.
机译：随着无线通信成为半导体行业的重要技术和增长引擎，许多半导体公司正在开发在该领域与众不同的技术。实现此目标的一种方法是找到一种将无源组件直接集成在芯片上的方法，该组件目前占当今无线手机中分立组件的70％以上，从而极大地简化了手机。尽管正在研究允许片上集成的多种技术，但微机电系统（MEMS）技术是这项开发工作的重要组成部分。仅举几个例子，它们已用于创建开关，滤波器，本地振荡器，可变电容器和高品质因数电感器。这些器件的光刻要求与标准半导体制造中的光刻要求有很大不同，其中最重要的是涉及在极端形貌上进行构图。在本文中，我们讨论了这些设备的一些制造挑战以及已证明可以满足这些挑战的一些方法。

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