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首页> 外文会议>Conference on High-Power Diode Laser Technology and Applications II; 20040126-20040127; San Jose,CA; US >New material options for high-power diode laser packaging
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New material options for high-power diode laser packaging

机译：大功率二极管激光封装的新材料选择

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摘要

Traditional materials have serious deficiencies in meeting requirements for thermal management and minimization of thermal stresses in high-power laser diode packaging. Copper, the standard material for applications requiring high thermal conductivity, has a coefficient of thermal expansion (CTE) that is much larger than those of ceramics and laser diodes, giving rise to thermal stresses when packages are subjected to thermal excursions. Traditional materials with low CTEs have thermal conductivities that are little or no better than that of aluminum. There are an increasing number of new packaging materials with low, tailorable CTEs and thermal conductivities up to four times those of copper that overcome these limitations. The ability to tailor material CTE has been used to solve critical warping problems in manufacturing, increasing yield from 5% to over 99%. Advanced materials fall into six categories: monolithic carbonaceous materials, metal matrix composites, carbon/carbon composites, ceramic matrix composites, polymer matrix composites, and advanced metallic alloys. This paper provides an overview of the state of the art of advanced packaging materials, including their key properties, state of maturity, using composites to fix manufacturing problems, cost and applications.
机译：传统材料在满足大功率激光二极管封装中的热管理要求和最小化热应力方面存在严重缺陷。铜是要求高导热性的标准材料，其热膨胀系数（CTE）远大于陶瓷和激光二极管的热膨胀系数，当封装经受热偏移时会产生热应力。具有低CTE的传统材料的导热率仅比铝好或没有。克服这些限制的新型包装材料越来越多，具有低，可定制的CTE和热导率高达铜的四倍。定制材料CTE的能力已用于解决制造中的关键翘曲问题，从而将良率从5％提高到了99％以上。先进材料分为六类：整体式含碳材料，金属基复合材料，碳/碳复合材料，陶瓷基复合材料，聚合物基复合材料和高级金属合金。本文概述了高级包装材料的技术水平，包括其关键性能，成熟度，使用复合材料来解决制造问题，成本和应用。

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