首页> 外文会议>Conference on laser applications in microelectronic and optoelectronic manufacturing VII; 20090126-29; San Jose, CA(US) >Advanced micromachining combining nanosecond lasers with water jet-guided laser technology
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Advanced micromachining combining nanosecond lasers with water jet-guided laser technology

机译:结合了纳秒级激光和水射流引导激光技术的先进微加工

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摘要

This paper presents the first scribing results obtained by combining a short-pulse 10ns green laser with the water jet-guided laser technology. A number of high-potential applications are presented, from the grooving of low-k silicon wafers, the scribing of metallic and amorphous Si layers of thin film solar cells, the grooving of SiC wafers, and dot marking of Si wafers. The combination of a short pulse laser beam with the water jet-guided laser technology offers a new industry-proven alternative for grooving and scribing processes, providing superior speed and quality compared to legacy laser technologies.
机译:本文介绍了通过将短脉冲10ns绿色激光与水射流引导激光技术相结合获得的第一个划线结果。从低k硅晶片的开槽,薄膜太阳能电池的金属和非晶硅层的刻划,SiC晶片的开槽和Si晶片的点刻,提出了许多高潜力的应用。短脉冲激光束与水射流引导的激光技术相结合,为开槽和划线工艺提供了一种业界公认的新选择,与传统的激光技术相比,具有更高的速度和质量。

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