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首页> 外文会议>Conference on Nondestructive Evaluation and Health Monitoring of Aerospace Materials and Composites III; 20040316-20040317; San Diego,CA; US >Application of a high numerical aperture lens to visualize disbonding between metallic films and polymer substrates with SAM
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Application of a high numerical aperture lens to visualize disbonding between metallic films and polymer substrates with SAM

机译：应用高数值孔径透镜通过SAM可视化金属膜与聚合物基材之间的剥离

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Due to increased demand for design flexibility, in recent years engineers have progressively employed polymers in the design of electronics enclosures. As the circuits in these enclosures are miniaturized, dissipate more thermal energy and run at higher clock speeds, electromagnetic interference (EMI) and heat dissipation concerns become more apparent and are more problematic. The high thermal impedance of polymers slows their implementation in these situations. In addition, many electronics devices are subject to industrial and governmental regulations for EMI emission and isolation. To address these concerns it is becoming increasingly popular to apply conformal metallic films to polymer-based enclosures to increase EMI shielding and decrease thermal impedance through heat spreading. As with any coating, quality assurance of adhesion between the film and substrate is of immense importance. Without standardized testing procedures for assuring the quality of these processes, it is difficult to place them into practice. When new and alternative manufacturing processes are brought forth quality assurance is of paramount importance. The majority of existing commercial testing procedures for determination of adhesion quality for metallic films pertain to metallic substrates. This paper presents the application of a practical shear wave lens to overcome these issues. It will be demonstrated that the shear wave lens will provide sufficient resolution in this application to allow visualization of bond quality and determination of to what degree a conformal coating has been achieved.
机译：由于对设计灵活性的需求增加，近年来，工程师在电子设备外壳的设计中逐渐采用了聚合物。随着这些机箱中的电路小型化，耗散更多的热能并以更高的时钟速度运行，电磁干扰（EMI）和散热问题变得更加明显，也变得更加棘手。在这些情况下，聚合物的高热阻会减慢其实施速度。此外，许多电子设备都受到有关EMI辐射和隔离的工业和政府法规的约束。为了解决这些问题，将保形金属膜应用于基于聚合物的外壳以增加EMI屏蔽并通过散热降低热阻变得越来越普遍。与任何涂层一样，保证薄膜与基材之间粘附力的质量至关重要。如果没有用于确保这些过程质量的标准化测试程序，就很难将它们付诸实践。提出新的和替代的制造工艺时，质量保证至关重要。用于确定金属膜的粘合质量的大多数现有商业测试程序都与金属基材有关。本文提出了一种实用的剪切波透镜来克服这些问题的应用。将会证明，在该应用中，剪切波透镜将提供足够的分辨率，以使粘结质量可视化，并确定已达到保形涂层的程度。

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