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Next generation mask metrology tool

机译:下一代口罩计量工具

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摘要

For next generation photo mask lithography the tolerance range for pattern placement and critical dimensions (CD) is further shrinking. Improved optical resolution and precision of a metrology system are required to qualify the lithography tool and monitor the photo mask process. Edge detection methods in transmitted light mode for pattern placement and CD measurements are advantageous if the tightened resolution and precision requirements can be met. The new LMS IPRO2 using an illumination wavelength range of 360 to 410 nm has a significantly enhanced resolution for registration and CD measurements in both, transmitted and reflected light. A new laser interferometer with an enhanced resolution of 0.3 nm contributes to the overall improved system performance. The stage is designed to measure on quartz substrates and next generation lithography (NGL) reticles up to 230 mm square in transmitted light as well as in reflected light on 200 mm and 300 mm wafers for stepper qualification.
机译:对于下一代光掩模光刻,图案放置和临界尺寸(CD)的公差范围正在进一步缩小。需要改进光学分辨率和计量系统的精度,以鉴定光刻工具和监视光掩模工艺。如果可以满足更严格的分辨率和精度要求,则在透射光模式下用于图案放置和CD测量的边缘检测方法将是有利的。新型LMS IPRO2使用360至410 nm的照明波长范围,可显着提高分辨率,可用于透射光和反射光的配准和CD测量。具有0.3 nm增强分辨率的新型激光干涉仪有助于整体上提高系统性能。该平台设计用于在石英基板和下一代光刻(NGL)掩模版上进行测量,该掩模版的透射光以及反射光在200 mm和300 mm晶片上的最大透射面积为230 mm平方,以进行步进鉴定。

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