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首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics III; 20040126-20040129; San Jose,CA; US >Basic investigations for controlling the laser spot welding process when packaging 3-dimensional molded interconnect devices
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Basic investigations for controlling the laser spot welding process when packaging 3-dimensional molded interconnect devices

机译：包装3D成型互连设备时控制激光点焊过程的基础研究

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摘要

This paper deals with basic investigations in order to control the laser spot micro welding process when packaging electronic components onto three dimensional molded interconnect devices (3-D MID) or flexible printed circuit boards. A wide range of experiments has been carried out for both successful and fail welds. Typical failures appearing during welding are either damage of the circuit board due to overpower or loss of connection between the welded components due to gap formation between the leads of the component and the circuit board. The optical radiation emitted from the process was firstly measured off-axially and co-axially with a spectrometer. To aid the spectrometric analysis, an optical sensor based on a silicon photo diode and an appropriate optical filter was applied for detecting the emitted radiation. The signal was acquired, analyzed, and saved using a dedicated software program. Changes in the detected radiation due to different weld conditions were evaluated. Moreover, the weld quality was investigated by Scanning Electron Microscope (SEM) measurements and cross-sectional analysis. A correlation has been found between the signal course and the weld quality. Primarily, there are three relevant signal phases (high peak, flat stage, and small peak) appearing during the weld. Any changes in the characteristic signal during these process phases can be used to predict the quality of the welds.
机译：本文将进行基础研究，以控制将电子元件包装到三维成型互连设备（3-D MID）或柔性印刷电路板上时的激光点焊微焊接过程。对于成功和失败的焊接，已经进行了广泛的实验。在焊接过程中出现的典型故障是由于功率过大而损坏电路板，或者由于部件的引线与电路板之间形成间隙而导致焊接部件之间的连接断开。首先用光谱仪离轴和同轴地测量从该过程发出的光辐射。为了帮助进行光谱分析，应用了基于硅光电二极管和合适的滤光片的光学传感器来检测发射的辐射。使用专用软件程序采集，分析和保存信号。评估了由于不同焊接条件导致的检测到的辐射变化。此外，通过扫描电子显微镜（SEM）测量和横截面分析研究了焊接质量。在信号过程和焊接质量之间发现了相关性。主要地，在焊接期间出现三个相关的信号相位（高峰值，平坦阶段和小峰值）。在这些过程阶段中，特征信号的任何变化都可以用来预测焊接质量。

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