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首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics III; 20040126-20040129; San Jose,CA; US >High-efficiency micro structuring of VUV window materials by laser-induced plasma-assisted ablation (LIPAA) with a KrF excimer laser
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High-efficiency micro structuring of VUV window materials by laser-induced plasma-assisted ablation (LIPAA) with a KrF excimer laser

机译：利用KrF准分子激光通过激光诱导的等离子体辅助烧蚀（LIPAA）高效VUV窗材料的微结构化

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摘要

We report on the micro structuring of fused silica (a-SiO_2) and calcium fluoride (CaF_2) with a conventional KrF excimer laser (248 nm) by utilization of the effects in the laser-induced plasma-assisted ablation (LIPAA). Mask projection of the UV light is realized onto the rear (instead of the front) side of the UV transparent samples. The plasma generated from a metal target located behind the rear surface of the VUV window effectively assists in the ablation. In the case of fused silica, we obtain high-quality complex micro structures with structure depths even above 500 μm in aspect ratios of 1:5 and better. The ablation rate in fused silica can reach a level as high as 1 μm per pulse with this novel method, demonstrating a remarkable efficiency. While the ablation rate observed for CaF_2 remains at 50 nm per pulse, the up to 100 μm deep micro structures demonstrate an excellent quality without signs of severe cracking or stress outside the mask projected area. This technique permits high-quality micro fabrication of bio-medical, electronic and opto-electronic devices based on oxides and fluorides by use of a conventional UV laser.
机译：我们通过利用激光诱导的等离子体辅助消融（LIPAA）中的效应，报告了用常规的KrF准分子激光（248 nm）对熔融石英（a-SiO_2）和氟化钙（CaF_2）的微观结构。可以将UV光的遮罩投射到UV透明样品的后侧（而不是前侧）。从位于VUV窗口后表面后面的金属靶产生的等离子体有效地帮助了消融。在熔融石英的情况下，我们获得了高质量的复杂微结构，其深宽比为1：5或更高，甚至超过500μm。通过这种新方法，熔融石英中的烧蚀速率可以达到每个脉冲高达1μm的水平，这证明了其卓越的效率。尽管对于CaF_2观察到的烧蚀速率保持在每个脉冲50 nm，但高达100μm的深微结构显示出优异的质量，而没有在掩膜投影区域外出现严重裂纹或应力的迹象。该技术允许通过使用常规的紫外线激光器，基于氧化物和氟化物对生物医学，电子和光电设备进行高质量的微制造。

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