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首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics III; 20040126-20040129; San Jose,CA; US >Analysis of thermal damage in bulk silicon with femtosecond laser micro-machining
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Analysis of thermal damage in bulk silicon with femtosecond laser micro-machining

机译：飞秒激光微加工分析大块硅中的热损伤

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摘要

Femtosecond laser micromachining of silicon offers the potential to realize precision components with minimal thermal damage. In this work, an assessment of the damage observed in bulk silicon during femtosecond laser micromachining is presented. The different analysis methods used to determine the structural and chemical changes to wafer grade silicon is first described. The analysis is at or above the ablation threshold - defined as the point where laser induced crystalline-damage is first observed for 1 kHz laser pulses, of 150 fs duration, at a wavele ngth of 775nm. Structural analysis is based upon electron and optical microscopies, with different sample preparation techniques being used to reveal the micro-machined structure. A key feature of the work presented here is the high-resolution Scanning Transmission Electron Microscope (STEM) images of the laser-machined structures. Below the ablation threshold, electrical experiments were performed with silicon under femtosecond laser excitation to provide a direct method for determining the accumulation of damage to the silicon lattice. Based on this analysis, it will be shown that laser machining of silicon with femtosecond pulses can produce features with minimal thermal damage, although lattice damage created by mechanical stresses and the deposition of ablated material both limit the extent to which this can be achieved, particularly at high aspect ratios.
机译：飞秒激光硅微加工提供了以最小的热损伤实现精密组件的潜力。在这项工作中，提出了飞秒激光微加工过程中在块状硅中观察到的损坏的评估。首先描述用于确定晶圆级硅的结构和化学变化的不同分析方法。分析达到或高于烧蚀阈值-定义为在775nm波长的150 kHz持续时间的1 kHz激光脉冲中首次观察到激光诱导的晶体损伤的点。结构分析基于电子和光学显微镜，使用不同的样品制备技术来揭示微机械结构。此处介绍的工作的关键特征是激光加工结构的高分辨率扫描透射电子显微镜（STEM）图像。在烧蚀阈值以下，在飞秒激光激发下对硅进行了电学实验，以提供直接的方法来确定对硅晶格的损伤累积。基于此分析，将显示出用飞秒脉冲对硅进行激光加工可以产生具有最小热损伤的特征，尽管由于机械应力和烧蚀材料的沉积而产生的晶格损伤都限制了其达到的程度，特别是高纵横比。

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