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首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics Jan 21-24, 2002 San Jose, USA >Excimer ablation of ITO on flexible substrates for large format display applications
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Excimer ablation of ITO on flexible substrates for large format display applications

机译：用于大幅面显示应用的柔性基板上的ITO准分子消融

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摘要

Excimer-based ablative patterning of Indium Tin Oxide (ITO) thin film on flexible substrates has been evaluated for large format display applications. In display package manufacturing, excimer-based ITO ablation can provide a great advantage over conventional photolithographic processing. It can eliminate many steps from the manufacturing cycle, resulting in significant cost reduction. Flexible substrate display packaging is desirable for at least two reasons. It allows roll-to-roll low cost, large volume manufacturing. Its low weight provides for an easy scale up to larger format displays. A XeCl excimer, 1x, amplitude mask pattern projection, scan-and-repeat system was utilized in the evaluation work. The mask pattern had line groupings of line-widths varying from 8 to 30 μm with line length of 44 mm. Lines from all the groupings were simultaneously ablated in 150 nm-thick ITO layer on a flexible 100 μm thick Polyethylene terephtalate (PET) substrate using scanning with optimized dwell duration of 10 pulses and optimized fluence level of 350 mJ/cm~2. Lines ablated with mask line groupings of line-width greater than or equal to 11 μm showed complete electrical isolation indicating complete ITO removal. Scanning Electron Microscopy (SEM) showed the presence of a slight curling effect at ablated line edges. The effect was studied as a function of wavelength and imaging resolution. A CO_2 snow cleaning method was evaluated for removing the extruding curled material.
机译：在大尺寸显示应用中，已经评估了在柔性基板上基于准分子的氧化铟锡（ITO）薄膜的烧蚀图案。在显示器包装制造中，基于准分子的ITO烧蚀可提供优于常规光刻工艺的巨大优势。它可以消除制造周期中的许多步骤，从而显着降低成本。出于至少两个原因，期望柔性基板显示器包装。它允许卷对卷的低成本，大批量制造。它的重量轻，可以轻松扩展到更大尺寸的显示器。在评估工作中使用了XeCl准分子，1倍，振幅掩模图案投影，扫描和重复系统。掩模图案具有线宽为8至30μm，线长为44mm的线组。使用最佳停留时间为10脉冲，最佳通量水平为350 mJ / cm〜2的扫描，同时在100μm厚的聚对苯二甲酸乙二醇酯（PET）柔性基板上的150 nm厚的ITO层中同时烧蚀所有组的谱线。线宽大于或等于11μm的掩模线组烧蚀的线显示出完全的电气隔离，表明已完全除去ITO。扫描电子显微镜（SEM）显示在烧蚀的线边缘处有轻微的卷曲作用。研究了该效应与波长和成像分辨率的关系。评价了CO_2除雪方法以除去挤出的卷曲材料。

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