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Finite element analysis of electric field assisted bonding

机译:电场辅助粘接的有限元分析

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摘要

An anodic bond is modeled as a moving nonmaterial line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. The component mass balance equations, Gauss law, and the linear momentum equation are placed in a finite elmeent formulation, which is used to predict the evolution of the sodium ion concentration, electric potnetial, and stress during anodic bonding of Pyrex glass and silicon.
机译:阳极键被建模为移动的非材料线,该线形成了代表未键合导体,未键合绝缘体和键合界面的三个材料表面的交点。组分质量平衡方程,高斯定律和线性动量方程置于有限elmeent公式中,该公式用于预测派热克斯玻璃和硅阳极键合期间钠离子浓度,电势和应力的变化。

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