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首页> 外文会议>Diamond amp; Abrasives engineering supplementary 2008 >The organic diamond disk (ODD)for dressing polishing pads of chemical mechanical planarization
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The organic diamond disk (ODD)for dressing polishing pads of chemical mechanical planarization

机译：用于修整化学机械平面化抛光垫的有机金刚石盘（ODD）

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摘要

Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers. The polishing rate of a wafer is dependent on the amplitude (height) of pad asperities. The polishing uniformity is controlled by the frequency (density) of such asperities. Current diamond pad conditioners cannot dress the pad to produce microns sized asperities at high density. This is because the tips of diamond grits cannot be leveled to the same height so the grooved pad top is uneven with excessive asperities that may ruin the wafer and under sized asperities that is easily glazed.New designs of diamond pad conditioners have markedly improved the leveling of diamond tips. Organic diamond disks (ODD) are manufactured by reverse casting of polymers. Due to the uniform spacing of diamond grits and their controlled tip heights, none of the diamond grits will be overly stressed. Moreover, all diamond grits are sharing the dressing work. Consequently, the number of working grits of ODD is significantly higher than conventional designs. Moreover, because no diamond will cut pad unecessarily, the pad life is greatly lengthened. Furthermore, due to the uniform distribution of pad asperities, the slurry will be held efficiently so the run off is avoided. As a result, the slurry usage is reduced. ODD is therefore a significant savor of CMP consumables for semiconductor manufacture.
机译：金刚石垫修整器可以确定CMP工艺的效率以及抛光晶片的质量。晶圆的抛光速率取决于焊盘粗糙的幅度（高度）。抛光均匀性由这种粗糙的频率（密度）控制。当前的金刚石垫修整器不能修整垫以在高密度下产生微米级的粗糙。这是因为金刚石磨粒的尖端无法调平到相同的高度，因此带凹槽的垫子顶部不平整，过度的凹凸可能会损坏晶片，而尺寸小的凹凸也容易上釉。新设计的金刚石垫调理剂显着改善了流平性钻石技巧。有机金刚石盘（ODD）通过反向浇铸聚合物制造。由于金刚石砂粒的间距均匀且其尖端高度受到控制，因此不会对金刚石砂粒施加过大的压力。此外，所有金刚石砂砾都在共享修整工作。因此，ODD的工作砂粒数量明显高于传统设计。而且，由于没有钻石会不必要地切割垫，因此垫寿命大大延长。此外，由于垫子凹凸的均匀分布，可以有效地保持浆料，从而避免了径流。结果，减少了浆料的使用。因此，ODD是用于半导体制造的CMP消耗品的重要味道。

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  • 来源
  • 会议地点 Zhengzhou(CN)
  • 作者

    Chou Cheng-Shiang; rnSung James C.; rnPai Yang-Liang; rnSung Michael;

  • 作者单位

    Chou Cheng-Shiang@KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan--Sung James C.@KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan;

    National Taiwan University, Taipei 106, Taiwan;

    National Taipei University of Technology, Taipei 106, Taiwan--Pai Yang-Liang@KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan--Sung Michael@Advanced Diamond Solutions, Inc., 351 King Street Suite 813, San Francisco, CA 94158, U. S. A.--;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 TTB30;
  • 关键词

    CMP; diamond dresser; pad conditioner; epoxy;

    机译：CMP;金刚石修整器;垫修整器;环氧树脂;

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