• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Electrochemical Society(ECS) Meeting;Symposium on Electrochemical Processing in ULSI and MEMS; 20070506-10;20070508-09; Chicago,IL(US);Chicago,IL(US) >Determination of Diffusion Boundary Layers and Copper Thickness Uniformity in Plating Tools Designed for 3-D Interconnect and Packaging Applications
【24h】

Determination of Diffusion Boundary Layers and Copper Thickness Uniformity in Plating Tools Designed for 3-D Interconnect and Packaging Applications

机译：用于3D互连和包装应用的电镀工具中扩散边界层和铜厚度均匀度的确定

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Limiting currents under mass transport limiting conditions were determined experimentally for two distinct types of electrochemical plating cells using voltammetric and chronoamperometric methods. The average limiting currents were used to estimate the thickness of the diffusion boundary layer that results from the novel cell configurations and agitation schemes. Additionally, the deposit thickness uniformity across the surface of copper plated substrates was experimentally determined and reported as the coefficient of variation (CV). Results show that optimization of the cell configurations and solution agitation within provides a thin uniform diffusion boundary layer thickness and low CVs for the metal thickness distribution indicating a uniform current distribution is achieved across the surface of the substrate.
机译：使用伏安法和计时电流法，通过实验确定了两种不同类型的电化学电镀池在传质极限条件下的极限电流。平均极限电流用于估计由新型电池结构和搅拌方案产生的扩散边界层的厚度。另外，实验确定了整个镀铜基板表面的沉积厚度均匀性，并记录为变化系数（CV）。结果表明，对电池构型和溶液搅拌的优化可提供较薄的均匀扩散边界层厚度和较低的CV（对于金属厚度分布而言），这表明在整个基板表面均实现了均匀的电流分布。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号