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Role of Additives in the Electrodeposition of Sn, Ag and Sn-Ag Films from Iodide-Pyrophosphate Solution

机译：添加剂在碘化物-焦磷酸盐溶液中电沉积Sn，Ag和Sn-Ag膜中的作用

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摘要

Studies towards the understanding of the electrodeposition Sn-Ag alloys from KI-K_4P_2O_7 solution and the effect of PEG 600 and Hydrazine Hydrochloride additives on their electrochemistry and material properties is presented. PEG acts as a complexing agent that reduces the difference in the reduction potentials of Sn~(+2) and Ag~+ species. Hydrazine Hydrochloride acts as an anti-oxidant of Sn~(+2) species and also a reducing agent of Sn~(+4) species to Sn~(+2). Hydrazine Hydrochloride also prevents the formation of Sn dendrites during electrodeposition, as the presence of Sn~(+4) is being proposed as one of the main causes of the dendrite formation. The ideal deposition conditions included the bath composition of Ag at 0.0035 M and deposition current density of 40 mA/cm~2. Stress measurements of the Sn-Ag films shows that it is Tensile. X-Ray analysis of the deposit showed the presence of pure Sn and Ag_3Sn intermetallic in the deposit.
机译：提出了对理解KI-K_4P_2O_7溶液中的电沉积Sn-Ag合金以及PEG 600和盐酸肼添加剂对其电化学和材料性能的影响的研究。 PEG用作络合剂，可减少Sn〜（+2）和Ag〜+物种的还原电势差。盐酸肼充当Sn〜（+2）物种的抗氧化剂，并且也是Sn〜（+4）物种对Sn〜（+2）的还原剂。盐酸肼还可防止电沉积过程中锡树枝状晶体的形成，因为有人提出存在Sn〜（+4）是树枝状晶体形成的主要原因之一。理想的沉积条件包括0.0035M的Ag浴组成和40mA / cm〜2的沉积电流密度。 Sn-Ag膜的应力测量表明它是拉伸的。沉积物的X射线分析表明，在沉积物中存在纯Sn和Ag_3Sn金属间化合物。

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  • 来源
    《Electronics and 3-D packaging 4》|2010年|p.29-52|共24页
  • 会议地点 Las Vegas NV(US);Las Vegas NV(US)
  • 作者

    V. Venkatasamy; S. Riemer; I. Tabakovic; M. T. Kief;

  • 作者单位

    Seagate Technology, Bloomington, MN 55435, USA;

    Seagate Technology, Bloomington, MN 55435, USA;

    Seagate Technology, Bloomington, MN 55435, USA;

    Seagate Technology, Bloomington, MN 55435, USA;

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  • 正文语种 eng
  • 中图分类 扩散;
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