• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Emerging technology in precision engineering XIV >Ultra-Precision Cutting of Single Crystal Silicon using Diamond Tool with Large Top Corner Radius
【24h】

Ultra-Precision Cutting of Single Crystal Silicon using Diamond Tool with Large Top Corner Radius

机译：使用具有大顶角半径的金刚石工具超精密切割单晶硅

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

A lot of studies on the ultra-precision cutting of single crystal silicon have been reported and they used the single crystal diamond cutting tools having the sharp cutting edge. However, the diamond cutting tools having small chamfer at the cutting edge are usually used in practical machining shops. In addition, studies on the relationship between the tool wear and the machined surface have been reported little although the relationship is important in practical applications. In this study, ultra-precision cutting of single crystal silicon, using cutting fluids, feed rate, and depth of cut as experimental parameters, was carried out with the single crystal diamond cutting tools having small chamfer and large nose radius, and the effects of the experimental parameters on the machining accuracy and tool wear were investigated. As a result, the optimum cutting conditions was obtained as follows: the cutting fluid was kerosene, the feed rate was 2.0μm/rev, and the depth of cut was 1.0μm.
机译：已经报道了许多关于单晶硅的超精密切削的研究，并且他们使用了具有锋利切削刃的单晶金刚石切削工具。然而，在切削刃处具有小的倒角的金刚石切削工具通常用于实际的机加工车间。另外，尽管在实际应用中该关系很重要，但关于刀具磨损与机加工表面之间关系的研究很少报道。在这项研究中，使用切削液，进给速度和切削深度作为实验参数对单晶硅进行超精密切削，该切削刀具具有小倒角和大刀尖半径，并且具有研究了有关加工精度和刀具磨损的实验参数。结果，获得了如下最佳切削条件：切削液为煤油，进给率为2.0μm/ rev，切削深度为1.0μm。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号