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首页> 外文会议>EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >ANALYTICAL MODELING OF ON-CHIP HOTSPOT COOLING USING SILICON THERMOELECTRIC MICROCOOLERS
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ANALYTICAL MODELING OF ON-CHIP HOTSPOT COOLING USING SILICON THERMOELECTRIC MICROCOOLERS

机译：硅热电冷却片对热斑冷却的分析建模

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摘要

Thermal management of microprocessors has become an increasing challenge in recent years because of localized high flux hotspots which can not be effectively removed by conventional cooling techniques. This paper describes the novel use of the silicon chip itself as thermoelectric microcooler to suppress the hotspot temperature. A three-dimensional analytical thermal model of the silicon chip, including localized silicon thermoelectric cooling, thermoelectric heating, Joule heating, hotspot heating, background heating, and conductive/convective cooling on the back of the silicon chip, is developed and used to predict the on-chip hotspot cooling performance. The effects of chip thickness, microcooler size, doping concentration and parasitic Joule heating from the electric contact resistance on hotspot cooling are investigated in details.
机译：近年来，由于局部高通量热点无法通过常规冷却技术有效消除，因此微处理器的热管理已成为日益严峻的挑战。本文介绍了硅芯片本身作为热电微冷却器来抑制热点温度的新颖用途。开发了硅芯片的三维分析热模型，包括局部硅热电冷却，热电加热，焦耳加热，热点加热，背景加热以及硅芯片背面的传导/对流冷却，并用于预测片上热点冷却性能。详细研究了芯片厚度，微冷却器尺寸，掺杂浓度和电接触电阻引起的寄生焦耳热对热点冷却的影响。

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