THERMOMECHANICAL AND CREEP BEHAVIOURS OF Au/Sn SOLDER ALLOY

机译：Au / Sn焊料合金的热力学和蠕变行为

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Au/Sn eutectic solder alloy is particularly attractive for high-power electronics and optoelectronics packaging as hermetic sealing and die attachment material. The robustness and reliability of solder joint are essential to meet the global demand for longer operating lifetime in their applications. The mechanical response of Au/Sn solder alloy is studied using nanoindentation (Nano-Test 600). Miniature creep samples were created using a specially designed fixture and static loading creep tests were carried out on these solder samples at temperatures of 25℃, 75℃ and 125℃ using tensile testing machine (Micro-Testing System). The Young's Modulus and hardness of 80Au/20Sn solder alloy increase with an increase in load rate or a decrease in temperature. The microstructure and creep rupture fractography of 80Au/20Sn solder alloy have been observed and analysed.

机译：Au / Sn共晶焊料合金作为密封和管芯连接材料对于高功率电子产品和光电包装特别有吸引力。焊点的坚固性和可靠性对于满足其应用中更长使用寿命的全球需求至关重要。使用纳米压痕（Nano-Test 600）研究了Au / Sn焊料合金的机械响应。使用专门设计的夹具创建微型蠕变样品，并使用拉伸试验机（Micro-Testing System）在25℃，75℃和125℃的温度下对这些焊料样品进行静态载荷蠕变测试。 80Au / 20Sn焊料合金的杨氏模量和硬度随着负载率的增加或温度的降低而增加。观察并分析了80Au / 20Sn焊料合金的显微组织和蠕变断裂形貌。

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来源
《EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US)》|2006年|P.165-169|共5页
会议地点 ChicagoIL(US)
作者
J. W. R. Tew; J.Wei; Y F. Sun; Y. C. Liu;
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作者单位

Singapore Institute of Manufacturing Technology;

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会议组织
原文格式 PDF
正文语种 eng
中图分类半导体器件制造工艺及设备;
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入库时间 2022-08-26 13:47:31

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2. Effect of aging treatment on microstructure and creep behaviour of Sn-Ag and Sn-Ag-Bi solder alloys [J] . A. F. Abd El-Rehim, H. Y. Zahran Materials Science and Technology: MST: A publication of the Institute of Metals . 2014,第4期

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3. Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part II. Creep Behavior of Bulk Solder and Solder/Copper Joints [J] . R.S. Sidhu, X. Deng, N. Chawla Metallurgical and Materials Transactions A . 2008,第2期

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4. THERMOMECHANICAL AND CREEP BEHAVIOURS OF Au/Sn SOLDER ALLOY [C] . J. W. R. Tew, J.Wei, Y F. Sun, ASME International Mechanical Engineering Congress and Exposition . 2007

机译：Au / Sn焊料合金的热机械和蠕变行为
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6. Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) system [O] . Michael Hindler, Zhongnan Guo, Adolf Mikula -1

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7. Characterization Of Creep Behaviours Of Soldered Joints Of A Nano-Composite Solder And Of Lead-Free Sn-Ag-Bi And Sn60Pb40 Solders [O] . Zhang X. P., Mai Y. W., Shi Y. W., 2004

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THERMOMECHANICAL AND CREEP BEHAVIOURS OF Au/Sn SOLDER ALLOY

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