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Bursting for Enhanced Ablation of Materials

机译:破裂以增强材料的烧蚀

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A significant enhancement in the rate of material removal is demonstrated using a nanosecond-pulsed UV fiber laser in multi-pulsing burst mode, as compared to the case without bursting. Percussion drilling and scribing of thin-film and bulk material tests show that, in general, laser bursts with increased pulse count and reduced pulse spacing show higher rates of material removal. A considerable improvement in removal rate is demonstrated, when bursting is applied to scribing of mono-crystalline silicon (m-Si), and up to 30% in percussion drilling speed. Likewise, improved material removal is demonstrated for scribing of thin film of indium tin oxide (ITO) on glass or metal film on sapphire. Examples of material processing are given with and without bursting at similar experimental conditions of average power, scan speed, and burst/pulse energies. Experimental results included are for m-Si, ITO thin films on glass, and metal films on sapphire.
机译:与没有爆裂的情况相比,使用多脉冲爆裂模式的纳秒脉冲UV光纤激光器证明了材料去除率的显着提高。薄膜和散装材料的冲击钻和划片测试表明,总的来说,脉冲数增加且脉冲间隔减小的激光突发显示出较高的材料去除率。当将爆裂应用于单晶硅(m-Si)的刻划时,可证明去除率有显着提高,并且冲击钻削速度最高可达到30%。同样,为了在玻璃或蓝宝石上的金属膜上刻划铟锡氧化物(ITO)薄膜,已证明了改进的材料去除效果。给出了在平均功率,扫描速度和脉冲/脉冲能量的类似实验条件下有或没有爆裂的材料处理示例。实验结果包括m-Si,玻璃上的ITO薄膜和蓝宝石上的金属膜。

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