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Application research of Diamond/Cu in solid-state microwave power module

机译：Diamond / Cu在固态微波功率模块中的应用研究

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摘要

Much focus has been placed on the thermal management of electronics in recent years. An overall reduction in size of electronic components as well as advances in chip technology, leading to ever higher power dissipation, have increased the necessity for innovative cooling designs. As a new generation of electronic packaging material, Diamond/Cu composites have excellent performances such as high thermal conductivity and adjustable CTE. In the present work, experimental studies have been conducted to reveal the feasibility of Diamond/Cu composites in industrial applications, and then the technical processing of its plating and welding was obtained. Moreover, the simulation tests of its thermal properties and harsh-environment-hardiness were conducted. The results validated that the use of Diamond/Cu in solid-state microwave power module's thermal design is feasible.
机译：近年来，人们非常关注电子设备的热管理。电子组件的整体减小以及芯片技术的进步，导致功耗越来越高，增加了创新冷却设计的必要性。作为新一代电子包装材料，Diamond / Cu复合材料具有出色的性能，例如高导热性和可调节的CTE。在目前的工作中，已经进行了实验研究以揭示金刚石/铜复合材料在工业应用中的可行性，然后获得了其电镀和焊接的技术处理。此外，还对其热性能和苛刻环境硬度进行了模拟测试。结果证明，在固态微波功率模块的热设计中使用金刚石/铜是可行的。

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