Correlation of critical ambient heat load of an orbicular cover sheltering electronics devices

机译：掩盖电子设备的球形盖的临界环境热负荷的相关性

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The critical ambient heat load of an orbicular cover sheltering electronics devices was numerically studied with a view to identifying the effects of several parameters, including solar radiant intensity, latitude, geometrical and thermo-physical properties of the orbicular cover, and thermal parameters of the ambient. The results of various working conditions showed that the above mentioned parameters all had effects on the critical ambient heat load. To identify and quantify the effects of these parameters, the results were mathematically processed, and then a correlation of critical ambient heat load was obtained. With this correlation, the critical ambient heat load of electronics devices in any orbicular cover could be calculated quickly regarding to various working conditions.

机译：为了确定几个参数（包括太阳辐射强度，纬度，球形盖的几何和热物理性质以及周围环境的热参数）的影响，对球形掩盖电子设备的临界环境热负荷进行了数值研究。。各种工作条件的结果表明，上述参数均对临界环境热负荷有影响。为了识别和量化这些参数的影响，对结果进行了数学处理，然后获得了临界环境热负荷的相关性。利用这种相关性，可以针对各种工作条件快速计算出任何球形盖中电子设备的临界环境热负荷。

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来源
《Fifth Asia International Symposium on Mechatronics》|2015年|1-4|共4页
会议地点 Guilin(CN)
作者
R. Zhao; J. Y. Qian; D. D. Zhan;
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作者单位

Nanjing Research Institute of Electronics and Technology, 210039, China;

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会议组织
原文格式 PDF
正文语种 eng
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关键词
correlation; critical ambient heat load; electronics devices; orbicular cover;

机译：相关;临界环境热负荷;电子设备;球形罩;

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Correlation of critical ambient heat load of an orbicular cover sheltering electronics devices

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