Effect of solder voids in brazing on microwave signal transmission performance

机译：钎焊中焊锡空隙对微波信号传输性能的影响

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摘要

Grounding is an important technology of microwave circuits. Brazing process can realize the grounding of microwave chip. However, the solder voids in brazing can make the reliability of grounding worse, deteriorating heat conduction performance and conductive properties, resulting in an error in signal transmission and significantly reduce the transmission performance of microwave signal. As the device operating frequency goes higher, solder voids can lead to serious signal integrity problems, for this reason, influence of different positions, sizes and number of void in brazing on signal transmission performance of microwave were investigated. The result shows that the void close to the feeding port has the greatest influence on the signal transmission performance, the signal transmission performance worsens with the volume of void enlarging, in addition, below the transmission line, with the increasing in number of voids, the signal transmission performance is deteriorated.

机译：接地是微波电路的一项重要技术。钎焊过程可以实现微波芯片的接地。但是，钎焊中的焊锡空洞会使接地的可靠性变差，导热性能和导电性能变差，从而导致信号传输中的误差，并且大大降低了微波信号的传输性能。随着器件工作频率的升高，焊锡空隙会导致严重的信号完整性问题，因此，研究了钎焊中焊锡空隙的不同位置，大小和数量对微波信号传输性能的影响。结果表明，靠近进料口的空隙对信号的传输性能影响最大，随着空隙体积的增大，信号的传输性能变差，此外，在传输线下方，空隙的数量增加，信号传输性能下降。信号传输性能下降。

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来源
《Fifth Asia International Symposium on Mechatronics》|2015年|1-5|共5页
会议地点 Guilin(CN)
作者
X. L. Peng; C. S. Wang; L. W. Song; J. S. Cheng; C. J. Yang; G. Z. Li; J. Huang; Z. H. Wang; Z. X. Min; J. Hu;
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作者单位

Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi'an, 710071, China;

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原文格式 PDF
正文语种 eng
中图分类
关键词
HFSS; brazing; grounding; signal transmission; void;

机译：HFSS;钎焊;接地;信号传输;无;

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Effect of solder voids in brazing on microwave signal transmission performance

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