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Out of the lab and into the fab: Nano-alignment as an enabler for Silicon Photonics' next chapter

机译:不在实验室内并进入制造厂:纳米对准技术将成为Silicon Photonics下一章的推动者

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The rapid advent of Silicon Photonics presents many challenges for test and packaging. Here we concisely review SiP device attributes that differ significantly from classical photonic configurations, with a view to the future beyond current, connectivity-oriented silicon photonics developments, looking to such endeavors as all-optical computing and quantum computing. The necessity for nano-precision alignment of optical elements in test and packaging operations quickly emerges as the unfilled need. We review the industrial test and packaging solutions developed back in the 1997-2001 photonics boom to address the needs of that era's devices, and map their gaps with the new SiP device classes. Finally we review the new state-of-the-art of recent advances in the field that address these gaps.
机译:硅光子学的迅速出现为测试和封装提出了许多挑战。在这里,我们简要回顾一下与传统光子配置大不相同的SiP器件属性,以期超越当前面向连接性的硅光子技术的发展,并寻求诸如全光计算和量子计算的努力。由于未满足的需求,在测试和包装操作中对光学元件进行纳米精度对准的必要性很快出现。我们回顾了1997-2001年光子学热潮中开发的工业测试和封装解决方案,以解决该时代设备的需求,并通过新的SiP设备类别来弥补它们之间的差距。最后,我们回顾了解决这些空白的最新领域最新进展。

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