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首页> 外文会议>Flexible Electronics 2004 -Materials and Device Technology >POLY-SI TFTs FROM GLASS TO PLASTIC SUBSTRATES: PROCESS AND MANUFACTURING CHALLENGES
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POLY-SI TFTs FROM GLASS TO PLASTIC SUBSTRATES: PROCESS AND MANUFACTURING CHALLENGES

机译：从玻璃到塑料基材的POLY-SI TFT：工艺和制造挑战

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摘要

Poly-Si Thin-Film Transistors (TFTs) are currently used in commercial active-matrix displays. They provide superior performance with respect to their amorphous silicon counterparts and allow integration of driving electronics directly on the display glass plates. For several applications, it can be desirable to have active-matrix displays made on flexible substrates. However, a direct application of a standard TFT process to plastic substrates is not in general possible, mostly because of temperature limits and related dimensional stability issues. In addition, standard flat-panel manufacturing tools are not capable of automatically handling non-rigid floppy substrates. Therefore, a new process has to be developed, compatible with a suitable way of handling plastic substrates. A process was developed in which plastic sheets are laminated on glass carrier wafers and run through all the automated tools. A low-temperature process using excimer laser annealing is developed and optimized. High-quality TFT backplanes are manufactured with a pixel layout designed for active-matrix OLED (AMOLED) displays. Field-effect mobility in excess of 70 cm~2Vs on p-channel TFTs are achieved, together with leakage currents lower than 2 pA per micron gate width. Challenges include low-temperature gate dielectric development, reduction of intrinsic film stress, protection of plastic from laser damage, and contact formation. Solutions to these challenges are discussed and TFT transfer characteristics on glass and plastic substrates are presented. Finally, images from prototype monochrome AMOLED displays are presented, with 64 x 64 pixels and 80-dpi resolution.
机译：多晶硅薄膜晶体管（TFT）当前用于商业有源矩阵显示器。它们相对于非晶硅具有卓越的性能，并允许将驱动电子设备直接集成在显示屏玻璃板上。对于几种应用，可能希望在柔性基板上制造有源矩阵显示器。但是，通常不可能将标准TFT工艺直接应用于塑料基板，这主要是因为温度限制和相关的尺寸稳定性问题。另外，标准的平板制造工具不能自动处理非刚性软盘基板。因此，必须开发一种与处理塑料基板的合适方式兼容的新工艺。开发了一种方法，其中将塑料片层压在玻璃载体晶片上，并通过所有自动化工具。开发和优化了使用准分子激光退火的低温工艺。高品质TFT背板采用像素布局制造，该像素布局设计用于有源矩阵OLED（AMOLED）显示器。在p沟道TFT上实现了超过70 cm〜2Vs的场效应迁移率，并且每微米栅极宽度的泄漏电流低于2 pA。挑战包括低温栅极电介质的开发，减少固有膜应力，保护塑料不受激光损坏以及形成接触。讨论了这些挑战的解决方案，并介绍了玻璃和塑料基板上的TFT传输特性。最后，展示了原型AMOLED单色显示器的图像，分辨率为64 x 64像素，分辨率为80 dpi。

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