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首页> 外文会议>Flexible Electronics 2004 -Materials and Device Technology >Ink-jetted Silver/Copper conductors for printed RFID applications
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Ink-jetted Silver/Copper conductors for printed RFID applications

机译：用于印刷RFID应用的喷墨银/铜导体

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Low-resistance printed conductors are crucial for the development of ultra-low cost electronic systems such as radio frequency identification tags. Low resistance conductors are required to enable the fabrication of high-Q inductors, capacitors, tuned circuits, and interconnects. Furthermore, conductors of appropriate workfunction are also required to enable fabrication of printed Schottky diodes, necessary for rectification in RFID circuits. Last year, we demonstrated the formation of low-resistance conductive printed structures using gold nanoparticles. Here we demonstrate, for the first time, technologies for formation of printed conductors using silver and copper nanoparticles. These are particularly advantageous for several reasons. First, both silver and copper offer a 2X reduction in sheet resistance over gold, resulting in improved interconnect performance and inductor Q. Second, the material costs associated with both silver and copper are expected to be significantly cheaper than gold. Third, the workfunction of silver enables the fabrication of all-printed Schottky diodes with a silver rectifying contact to many common printable organic semiconductors. Solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. We describe novel processes for forming silver and copper nanoparticles, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the size of the nanoparticle and the encapsulant sublimation kinetics, it is possible to produce particles that anneal at low-temperatures ( < 150 ℃) to form continuous films having low resistivity and appropriate workfunction for formation of rectifying contacts. This represents a major component required for all-printed RFID.
机译：低电阻印刷导体对于开发超低成本电子系统（例如射频识别标签）至关重要。需要低电阻导体才能制造高Q电感器，电容器，调谐电路和互连。此外，还需要具有适当功函数的导体以使得能够制造印刷的肖特基二极管，这对于RFID电路中的整流是必需的。去年，我们展示了使用金纳米颗粒形成的低电阻导电印刷结构。在这里，我们首次展示了使用银和铜纳米粒子形成印刷导体的技术。由于几个原因，这些是特别有利的。首先，银和铜的薄层电阻都比金降低了2倍，从而改善了互连性能和电感Q。第二，与银和铜相关的材料成本预计将比金便宜得多。第三，银的功函数使得能够制造与许多常见的可印刷有机半导体具有银整流接触的全印刷肖特基二极管。可以印刷有机封装的银和铜纳米粒子的溶液，然后退火以形成低电阻导体图案。我们描述了形成银和铜纳米粒子的新颖工艺，并讨论了印刷/退火工艺的优化，以证明塑料兼容的低电阻导体。通过优化纳米粒子的尺寸和密封剂的升华动力学，可以生产在低温（<150℃）下退火的粒子，从而形成具有低电阻率和适当功函数的连续膜，以形成整流触点。这代表了全印刷RFID所需的主要组件。

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