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Emerging Low Cost LED Thermal Management Materials

机译：新兴的低成本LED热管理材料

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摘要

As chip size and power levels continue to increase, thermal management, thermal stresses and cost have become key LED packaging issues. Until recently, low-coefficient-of-thermal-expansion (CTE) materials, which are needed to minimize thermal stresses, had thermal conductivities that are no better than those of aluminum alloys, about 200 W/m-K. Copper, which has a higher thermal conductivity (400 W/m-K), also has a high CTE, which can cause severe thermal stresses. We now have over a dozen low-CTE materials with thermal conductivities ranging between 400 and 1700 W/m-K, and almost a score with thermal conductivities at least 50% greater than mat of aluminum. Some of these materials are low cost. Others have the potential to be low cost in high volume production. Emphasizing low cost, this paper reviews traditional packaging materials and the six categories of advanced materials: polymer matrix-, metal matrix-, ceramic matrix-, and carbon matrix composites; monolithic carbonaceous materials; and metal-metal composites/alloys. Topics include properties, status, applications, cost and likely future directions of new advanced materials, including carbon nanotubes and inexpensive graphite nanoplatelets.
机译：随着芯片尺寸和功率水平的不断提高，热管理，热应力和成本已成为LED封装的关键问题。直到最近，为使热应力最小化而需要的低热膨胀系数（CTE）材料的热导率并不比铝合金的热导率好，约为200 W / m-K。具有较高热导率（400 W / m-K）的铜，也具有较高的CTE，这会引起严重的热应力。现在，我们有十几种低热膨胀系数材料，其导热率在400到1700 W / m-K之间，几乎达到了导热率比铝垫高至少50％的程度。这些材料中的一些是低成本的。其他则有可能在批量生产中降低成本。强调低成本，本文回顾了传统包装材料和六类高级材料：聚合物基体，金属基体，陶瓷基体和碳基复合材料；整体碳质材料；和金属-金属复合材料/合金。主题包括碳纳米管和廉价石墨纳米片等新型先进材料的性能，现状，应用，成本以及未来可能的发展方向。

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