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首页> 外文会议>Frontiers in ultrafast optics: biomedical, scientific, and industrial applications XVI >Time-resolved study of femtosecond laser induced micro-modifications inside transparent brittle materials
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Time-resolved study of femtosecond laser induced micro-modifications inside transparent brittle materials

机译：飞秒激光诱导的透明脆性材料内部微变的时间分辨研究

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摘要

Laser processing of optically transparent or semi-transparent, brittle materials is finding wide use in various manufacturing sectors. For example, in consumer electronic devices such as smartphones or tablets, cover glass needs to be cut precisely in various shapes. The unique advantage of material processing with femtosecond lasers is efficient, fast and localized energy deposition in nearly all types of solid materials. When an ultrashort laser pulse is focused inside glass, only the localized region in the neighborhood of the focal volume absorbs laser energy by nonlinear optical absorption. Therefore, the processing volume is strongly defined, while the rest of the target stays unaffected. Thus ultrashort pulse lasers allow cutting of the chemically strengthened glasses such as Corning~® Gorilla~® glass without cracking. Non-ablative cutting of transparent, brittle materials, using the newly developed femtosecond process ClearShape™ from Spectra-Physics~®, is based on producing a micron-sized material modification track with well-defined geometry inside. The key point for development of the process is to understand the induced modification by a single femtosecond laser shot. In this paper, pump-probe microscopy techniques have been applied to study the defect formation inside of transparent materials, namely soda-lime glass samples, on a time scale between one nanosecond to several tens of microseconds. The observed effects include acoustic wave propagation as well as mechanical stress formation in the bulk of the glass. Besides better understanding of underlying physical mechanisms, our experimental observations have enabled us to find optimal process parameters for the glass cutting application and lead to better quality and speed for the ClearShape™ process.
机译：光学透明或半透明的脆性材料的激光加工正在各种制造领域得到广泛使用。例如，在诸如智能电话或平板电脑之类的消费电子设备中，盖玻片需要精确地切割成各种形状。飞秒激光器进行材料处理的独特优势是，几乎所有类型的固体材料都可以高效，快速且局部地进行能量沉积。当超短激光脉冲聚焦在玻璃内部时，只有焦点体积附近的局部区域才会通过非线性光学吸收吸收激光能量。因此，处理量被严格定义，而其余目标则保持不变。因此，超短脉冲激光器可以切割化学强化玻璃，例如Corning〜®Gorilla®®玻璃，而不会破裂。使用Spectra-Physics〜®最新开发的飞秒工艺ClearShape™进行的透明，易碎材料的非烧蚀切割，是基于内部具有定义明确的几何形状的微米级材料修饰轨迹的制造。开发该过程的关键点是了解单飞秒激光发射引起的修饰。在本文中，泵浦探针显微镜技术已被用于研究透明材料（即钠钙玻璃样品）内部的缺陷形成，时间范围为1纳秒至数十微秒。观察到的影响包括声波传播以及在玻璃中形成的机械应力。除了更好地了解潜在的物理机制外，我们的实验观察还使我们能够找到适合玻璃切割应用的最佳工艺参数，并为ClearShape™工艺带来更高的质量和速度。

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