首页> 外文会议>Frontiers in ultrafast optics: biomedical, scientific, and industrial applications XVI >Femtosecond Lasers for Machining of Transparent, Brittle Materials: Ablative vs. Non-Ablative Femtosecond Laser Processing
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Femtosecond Lasers for Machining of Transparent, Brittle Materials: Ablative vs. Non-Ablative Femtosecond Laser Processing

机译:飞秒激光加工透明,脆性材料:烧蚀与非烧蚀飞秒激光加工

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摘要

This paper focuses on precision machining of transparent materials by means of ablative and non-ablative femtosecond laser processing. Ablation technology will be compared with a newly developed patent pending non-ablative femtosecond process, ClearShape™, using the Spectra-Physics~® Spirit~® industrial femtosecond laser.
机译:本文着重于通过烧蚀和非烧蚀飞秒激光加工对透明材料进行精密加工。使用Spectra-Physics〜Spirit〜®工业飞秒激光器,将消融技术与新开发的正在申请专利的非消融飞秒工艺ClearShape™进行比较。

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