High temperature electrical conductivity in the Cu solubility limit range in ZnS : Cu

机译：ZnS：Cu中Cu溶解度极限范围内的高温电导率

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The high temperature electrical conductivity (HTEC) and the solubility of Cu in Cu-doped ZnS single crystals are investigated in the temperature range from 973 to 1373 K as a function of Zn and S_2 vapour pressure. In equilibrium of ZnS with Cu_2S, the solubility of Cu is independent of the zinc vapour pressure and decreases by several orders of magnitude in equilibrium with Cu-Zn alloys. The change in solubility of Cu influences the HTEC isotherms and is expressed as the change of the type of dominating defects. direct c 1999 Elsevier Science B.V. All rights reserved.

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《Growth, characterisation and applications of bulk II-VIs》|1998年|p.489-492|共4页
会议地点 Strasbourg(FR)
作者
K.Lott; M.Raukas; A.Vishnjakov; A.Grebennik;
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原文格式 PDF
正文语种 eng
中图分类电工技术;
关键词
Cu-doped ZnS; Chemical solubility limit; High temperature electrical conductivity; Defect equilibria;

机译：掺杂铜的ZnS;化学溶解度极限；高温电导率；缺陷平衡;

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专利

1. High temperature eelctrical conductivity in the Cu solubility limit range in ZnS: Cu [J] . K. Lott, M. Raukas, A. Vishnjakov Journal of Crystal Growth . 1999,第3期

机译：ZnS中Cu溶解度极限范围内的高温电导率
2. The measurements of electrical and thermal conductivity variations with temperature and phonon component of the thermal conductivity in Sn-Cd-Sb, Sn-In-Cu, Sn-Ag-Bi and Sn-Bi-Zn alloys [J] . Altintas Yemliha, Kaygisiz Yusuf, Ozturk Esra, International Journal of Thermal Sciences . 2016,第Null期

机译：Sn-Cd-Sb，Sn-In-Cu，Sn-Ag-Bi和Sn-Bi-Zn合金的电导率和热导率随温度和声子组成的变化
3. High temperature electrical conductivity in Ga and In solubility limit region in ZnS [J] . K. Lott, M. Raukas, O. Volobujeva, International journal of inorganic materials . 2001,第8期

机译：Zn中Ga和In溶解度极限区域的高温电导率
4. High temperature electrical conductivity in the Cu solubility limit range in ZnS : Cu [C] . K.Lott, M.Raukas, A.Vishnjakov, Symposium C on growth, characterisation and applications of bulk II-VIs of the E-MRS 1998 spring conference . 1999

机译：ZnS：Cu的Cu溶解度极限范围内的高温电导率
5. The influence of microstructure on the strength and electrical conductivity of directionally-solidified Cu-Ag microcomposites. [D] . Sohn, Keun Yong. 1997

机译：微观结构对定向凝固Cu-Ag微复合材料强度和电导率的影响。
6. Nearly Constant Electrical Resistance over Large Temperature Range in Cu3NMx (M = Cu Ag Au) Compounds [O] . Nianpeng Lu, Ailing Ji, Zexian Cao -1

机译：Cu3NMx（M = CuAgAu）化合物在大温度范围内几乎恒定的电阻
7. Electrical Conductivity by Addition of Zn and Cu on Mg-Zn-Cu Alloys [O] . Dae-Hee Ye, Hyun-Sik Kim, Min-Cheol Kang, 2014

机译：通过在Mg-Zn-Cu合金中添加Zn和Cu的电导率

High temperature electrical conductivity in the Cu solubility limit range in ZnS : Cu

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