Abstract: Recently, the promise of major reductions in the priceof synthetic diamond has allowed its consideration foruse in electronic thermal management applications, suchas MCM substrates, requiring many tens of grams ofmaterial (e.g., 100 mm square substrates, 1 mm thick).Because of the combination of extremely high thermalconductivity and electrically insulating nature,diamond is an ideal IC packaging or MCM substratematerial; diamond can cool, through lateral thermalconduction to board edges alone, MCMs having manyhundreds of watts power dissipation, and at the sametime allow for a high density of vertical viainterconnects through the diamond substrate. Thisdiamond 3-D packaging approach is capable of handling,with a modest temperature rise, a power density of 200Watts per cubic inch, which corresponds to a potentialcomputational density of over 1300 MFlops per cubicinch or 83 GFlops in a 4' $MUL 4' $MUL 4' cube withcurrent processor technology. !9
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机译：摘要：最近，大幅降低合成钻石价格的承诺已使其考虑用于电子热管理应用，如MCM基板，需要数十克的材料（例如100毫米方形基板，1毫米厚）。金刚石具有极高的导热性和电绝缘性，是一种理想的IC封装或MCM基板材料。金刚石可以通过横向导热直接冷却到板的边缘，从而冷却具有数百瓦功率的MCM，同时允许通过金刚石基板的高密度垂直通孔互连。这种金刚石3D封装方法能够在温度适度升高的情况下处理200瓦特/立方英寸的功率密度，这对应于4'$ MUL 4'$的潜在计算密度超过1300 MFlops /立方英寸或83 GFlops。具有当前处理器技术的MUL 4'立方体。 ！9
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