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Laser propulsion of microelectronic components: releasing mechanism investigation

机译:微电子元件的激光推进:释放机理研究

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Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.
机译:近年来,激光推进越来越受到关注。超高平均功率激光系统已经出现,并在将卫星发射到太空中发现了应用。烧蚀产生的脉冲也可用于移动小零件。本文介绍了激光诱导的微电子元件从其载体材料释放。释放机理可分为:剥离释放和热释放,取决于聚合物(用作组件的载体材料)以及使用低还是高激光通量。研究并给出了不同工况下的方向变化和速度变化。演示了该技术作为快速微电子元件组装方法的应用。

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