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首页> 外文会议>IMAC-XXI: a conference amp; exposition on structural dynamics >TEST TAILORING METHODOLOGY FOR IMPACT TESTING OF PORTABLE ELECTRONIC PRODUCTS.
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TEST TAILORING METHODOLOGY FOR IMPACT TESTING OF PORTABLE ELECTRONIC PRODUCTS.

机译：便携式电子产品冲击测试的测试定制方法。

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摘要

This paper introduces a test methodology to examine therndurability of surface mount interconnects under impactrnloading when a portable electronic product is dropped.rnConventional testing approaches that consider thernmagnitude of loading (total impact energy, impact direction,rnand number of impacts) as the governing criterion forrndamage accumulation, typically report difficulties inrncorrelating with impact durability under field conditions. Thisrnstudy considers the specimen response near the failure siternas the governing criterion. For example, impact damagernaccumulated in Surface Mount Technology (SMT)rninterconnects are quantified in terms of local Printed WiringrnBoard (PWB) flexural strain, strain rate and rigid bodyrnacceleration. This approach is based on the hypothesis thatrninterconnect damage is due to PWB flexure as well asrninertial forces. The advantage of this approach is that thernresulting damage models are applicable across differentrnstructures and loading. An instrumented, repeatable impactrntest setup is developed. The design space, in terms of PWBrncurvature, curvature rate and acceleration, is covered byrnvarying impact orientation, loading and boundary conditions.rnThe resulting test matrix is replicated twice for proof ofrnconsistency of the test data. A damage quantificationrntechnique is proposed based on the measured histories ofrnPWB flexure and rigid body acceleration near the criticalrninterconnects. This technique uses time-frequencyrndecomposition and cycle counting. The validity of this metricrnis demonstrated for simple impact loading conditions onrnspecimens that are constrained to have no rigid bodyrnmotion. Unconstrained specimens exhibit complexrnresponses and are deferred to a future study.
机译：本文介绍了一种测试方法，用于检查跌落便携式电子产品时在冲击载荷下表面安装互连的耐用性.rn传统测试方法将载荷的大小（总冲击能量，冲击方向，冲击次数和冲击次数）作为损伤累积的控制标准，通常会报告与野外条件下的冲击耐久性无关的困难。本研究将失效部位附近的试样响应作为控制标准。例如，表面贴装技术（SMT）互连中累积的冲击损伤可以根据局部印刷线路板（PWB）的挠曲应变，应变率和刚体加速度进行量化。这种方法基于以下假设：互连损坏是由于PWB弯曲以及惯性力引起的。这种方法的优点是产生的损伤模型适用于不同的结构和载荷。开发了一种仪器化的，可重复的冲击测试设置。设计空间在PWB曲率，曲率和加速度方面通过变化的冲击方向，载荷和边界条件来覆盖。为保证测试数据的一致性，将生成的测试矩阵重复两次。根据在关键互连附近的PWB挠曲和刚体加速度的测量历史，提出了一种损伤量化技术。该技术使用时频分解和周期计数。该度量标准的有效性证明了在没有刚性体运动的简单冲击载荷条件下。不受约束的标本表现出复杂的响应，并推迟到以后的研究中。

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  • 来源
  • 会议地点 Kissimmee FL(US)
  • 作者

    J. Varghese; A. Dasgupta;

  • 作者单位

    CALCE Electronic Packaging and Systems Center, Department of Mechanical Engineering,rnUniversity of Maryland, College Park, MD 20740rnTel: 301-405-5251, Fax: 301-314-9269, Email: josephv@calce.umd.edu;

    CALCE Electronic Packaging and Systems Center, Department of Mechanical Engineering,rnUniversity of Maryland, College Park, MD 20740rnTel: 301-405-5251, Fax: 301-314-9269, Email:dasgupta@eng.umd.edu;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 结构力学;结构力学;
  • 关键词

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