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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >The Effect of Solder Selection on High Platinum Palladium Silver Thick Film Conductors
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The Effect of Solder Selection on High Platinum Palladium Silver Thick Film Conductors

机译：焊料选择对高铂钯银厚膜导体的影响

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With the implementation of the Restriction of Hazardous Substance (RoHS) Directive banning the use of Lead, Cadmium, Mercury and Hexavalent Chrom ium,, hybrid microelectronic manufacturers are globally embracing the lead free movement. These manufacturers must not only understand the implications of their material choice but must be aware of the interaction between lead free solder alloys and their RoHS compliant thick film materials.rnIt is commonly known that lead free solder alloys process at altered reflow profiles, but there are other concerns. Lead free solder alloys generally require a modified organic flux system to promote wetting and reflow. The appearance of lead free solder fillets can be dissimilar from traditional tin lead based solders. These situations provide additional challenges for the hybrid circuit manufacturer. There is limited information available regarding the effects of the lead free solders on RoHS compliant thick film materials. During the development of thick film material, in conjunction with Pb free solders, a previously unseen adhesion failure mechanism was identified. This failure occurred primarily in high Pd containing conductors.rnThis paper investigates, in more detail, this unfamiliar adhesion failure mechanism and the results obtained from a customized family of Pb/Cd free thick film conductors. A range of high percentage Palladium Silver and Platinum Palladium Silver thick film conductors were developed and evaluated. These conductors were assessed by comparing lead free solder alloys to traditional tin lead silver solder alloys. Solderability, leach resistance, initial and long term adhesion studies and SEM photos will be presented. Results are available describing the diversity in behavior between the solder alloys in conjunction with the varied Pt/Pd/Ag and Pd/Ag ratios.
机译：随着《有害物质限制（RoHS）指令》禁止铅，镉，汞和六价铬的使用，混合微电子制造商正在全球范围内拥抱无铅运动。这些制造商不仅必须了解他们的材料选择的含义，还必须了解无铅焊料合金与符合RoHS要求的厚膜材料之间的相互作用。众所周知，无铅焊料合金会在改变回流曲线的情况下进行加工，但是其他问题。无铅焊料合金通常需要改进的有机助焊剂系统以促进润湿和回流。无铅焊料圆角的外观可能与传统的锡铅基焊料不同。这些情况给混合电路制造商带来了额外的挑战。关于无铅焊料对符合RoHS要求的厚膜材料的影响的信息有限。在厚膜材料的开发过程中，结合无铅焊料，发现了以前看不见的粘合破坏机理。这种失效主要发生在含高Pd的导体上。本文更详细地研究了这种陌生的粘合失效机理，以及从定制的不含Pb / Cd厚膜导体系列中获得的结果。开发并评估了一系列高百分比的钯银和铂钯银厚膜导体。通过将无铅焊料合金与传统的锡铅银焊料合金进行比较来评估这些导体。将介绍可焊性，耐溶出性，初始和长期粘合性研究以及SEM照片。有可用的结果描述了不同的Pt / Pd / Ag和Pd / Ag之比与焊料合金之间的行为差​​异。

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