PB-FREE SOLDER FOR PORTABLE AND HIGH TEMPERATURE ELECTRONIC DEVICES

机译：便携式和高温电子设备的无铅焊料

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As the European Union's (EU's) RoHS directives came into force on July 2006, the transition to lead-free solder has occurred at a rapid pace. Many manufacturers have adopted Sn/Ag/Cu (SAC)-type solder alloys as a representative Pb-free solder to substitute the conventional Tin-Lead (Sn-Pb) system with many reliability anomalies unanswered. This paper is an effort to compare solder reliability between the two most popular Pb-free solders SAC305 and SAC 105 for temperature cycling and drop test. Solder reliability for drop test and temperature cycling were determined experimentally and verified using finite element simulations. The results were interpreted and the recommendations for the right Pb-free solder were made for practical applications.

机译：随着欧盟（RoHS）指令于2006年7月生效，向无铅焊料的过渡正在迅速进行。许多制造商已采用Sn / Ag / Cu（SAC）型焊料合金作为代表性的无铅焊料，以替代传统的锡铅（Sn-Pb）系统，该系统存在许多无法解决的可靠性异常。本文致力于比较两种最流行的无铅焊料SAC305和SAC 105在温度循环和跌落测试中的焊料可靠性。实验确定了跌落测试和温度循环的焊锡可靠性，并使用有限元模拟对其进行了验证。对结果进行了解释，并针对实际应用提出了正确的无铅焊料建议。

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来源
《IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain》|2008年|p.000579-000587|共9页
会议地点 Providence RI(US);Providence RI(US)
作者
Ganesh Iyer; Eric Ouyang; Witoon Kittidacha; Suresh LK;
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作者单位

Spansion Inc. Sunnyvale, CA 94088;

rnSpansion Inc. Sunnyvale, CA 94088 Phone: 408 962 2500 Eric.Ouyang@spansion.com;

rnSpansion Inc. Sunnyvale, CA 94088;

rnSpansion Inc. Sunnyvale, CA 94088;

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会议组织
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
RoHS; Pb-free; drop test; thermal aging; experiment; ANSYS;

机译：RoHS；无铅跌落测试;热老化；实验; ANSYS;

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机译：PB焊料和可口焊料的生命周期库存分析适用于电子设备
3. Metallurgy of low temperature Pb-free solders for electronic assembly [J] . J. Glazer International Materials Reviews . 1995,第2期

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4. PB-FREE SOLDER FOR PORTABLE AND HIGH TEMPERATURE ELECTRONIC DEVICES [C] . International symposium on microelectronics . 2008

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5. Synthesis, Formulation, and Reliability Study of Novel Pb-Free Nanocomposite Solder Pastes for Electronics Assembly and Packaging [D] . Wernicki, Evan . 2020

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6. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [O] . Chih-han Yang, Shiqi Zhou, Shih-kang Lin, 2019

机译：Sn-Bi-In-Ga四元合金低温无铅焊料的计算热力学辅助开发
7. Life Cycle Inventory Analyses of Pb Solder and Pb-free Solder Applicable to Electronic Devices [O] . Takashi YAMAGUCHI, Yasunari MATSUNO, Masaru YAMASHITA, 2003

机译：Pb焊料和可用PB的可应用于电子设备的生命周期库存分析

PB-FREE SOLDER FOR PORTABLE AND HIGH TEMPERATURE ELECTRONIC DEVICES

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