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Millimeter-wave Radio System In A Package

机译:封装中的毫米波无线电系统

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摘要

The thirst for higher data rates and more bandwidth has resulted in increased interest in millimeter-wave systems as a means for local and wider area information transport. At the same time there is a real need for lower cost and more compact systems. These requirements have lead to the development of a highly integrated millimeter-wave System In a Package (SIP) which operates beyond 40GHz. This solution uses low cost ceramic packaging and optimized interconnects and transitions to allow for wide band electrical performance. This paper will present details on the functionality, electrical performance and packaging used to realize this solution.
机译:对更高数据速率和更多带宽的需求已导致人们对毫米波系统越来越感兴趣,因为毫米波系统是用于本地和更广域信息传输的一种手段。同时,确实需要更低的成本和更紧凑的系统。这些要求导致了工作频率超过40GHz的高度集成毫米波封装系统(SIP)的开发。该解决方案使用低成本陶瓷封装以及优化的互连和过渡,以实现宽带电气性能。本文将详细介绍用于实现该解决方案的功能,电气性能和封装。

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