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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Low CTE LCP for Ultra Low Stress Near Hermetic Package for MMICApplications
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Low CTE LCP for Ultra Low Stress Near Hermetic Package for MMICApplications

机译：适用于MMIC应用的超低应力近密封封装的低CTE LCP

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摘要

A low cost, near hermetic, lighter weight than ceramic package with a low coefficient of thermal expansion (CTE)rnutilizing liquid crystal polymer (LCP) core substrate has been fabricated. An air cavity package is developed tornreduce stress on die and warpage while providing better RF performance by reducing the dielectric environment tornair. Initial prototypes include a heat sink of metal matrix composite (MMC) AlSiC material, 4 mils core of 5 ppm/KrnLCP and an LCP lid. The package outline dimensions are 4.0 mm × 7.65 mm × 1.0 mm. Two major issues wererndiscovered during assembly process, the heatsink attach process due to tight dimensions has misalignment problemsrnand caused warpage to the overall package due to pressure applied during assembly. The second issue is the LCPrnsubstrate bottom layer has a 5 mil recess from the bottom of heat sink, which does not match IPC standards of 4 milrnmaximum for level 2 packaging to the board. An alternative approach of embedding AlSiC material shows promisernfor overcoming the above two issues.
机译：与利用低热膨胀系数（CTE）的利用液晶聚合物（LCP）芯​​基板的陶瓷封装相比，已经制造了低成本，近乎密封，重量轻的陶瓷封装。开发出一种空气腔封装，以减少管芯和翘曲应力，同时通过减少介电环境，从而提供更好的RF性能。最初的原型包括金属基质复合材料（MMC）AlSiC材料的散热器，5 ppm / KrnLCP的4密耳芯和LCP盖。封装外形尺寸为4.0毫米×7.65毫米×1.0毫米。在组装过程中发现了两个主要问题，由于尺寸紧凑而导致的散热器连接过程存在未对准问题，并且由于在组装过程中施加的压力而导致整个封装翘曲。第二个问题是LCPrn基板的底层从散热器的底部有500密耳的凹口，这与IPC标准（用于2级封装到板上的最大密耳400密耳）不匹配。嵌入AlSiC材料的另一种方法显示出克服上述两个问题的希望。

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