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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Vertical Interconnects Using Magnetically Aligned Anisotropic Conductive Adhesive for RF Packaging
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Vertical Interconnects Using Magnetically Aligned Anisotropic Conductive Adhesive for RF Packaging

机译：使用磁对准各向异性导电胶进行垂直互连以进行RF包装

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摘要

A novel anisotropic conductive adhesive (ACA) with ferromagnetic conductive particles is studied for vertical interconnects in high frequency applications. When the static magnetic field is induced, randomly dispersed conductive particles in an epoxy are aligned along the given magnetic field. To verify the RF characteristics of the ACA, coplanar waveguides (CPW) on silicon substrates were fabricated. Using a flip-chip bonding technology, fabricated silicon substrates with a 100 μm × 80 μm transition region were assembled. The magnetically aligned. Z-axis ACAs with two different diameter of conductive particles (10 μm and. 25 μm) were used, to characterize the created interconnects. As a result, it was observed that the density of created columns on a transition region dominates the performance of assembled samples at high frequencies and the performance of assembled samples using the smaller particle (10 μm diameter) is more repeatable in 100 μm × 80 μm pad dimension. In comparison to the silicon sample with solder bumps, the difference in the insertion loss is less than 0.25 dB up to 20 GHz. Therefore, the magnetically aligned ACA is expected to become a promising alternative to high-frequency applications with less than 100 μm pad dimension and. narrow pitches.
机译：研究了一种具有铁磁导电颗粒的新型各向异性导电胶（ACA），用于高频应用中的垂直互连。当感应出静磁场时，环氧树脂中随机分散的导电颗粒会沿着给定的磁场排列。为了验证ACA的RF特性，在硅基板上制造了共面波导（CPW）。使用倒装芯片键合技术，组装了具有100μm×80μm过渡区的硅基板。磁性对齐。 Z轴ACA具有两个不同直径的导电粒子（10μm和25μm），用于表征所创建的互连。结果发现，在过渡区域上创建的列的密度支配了高频下组装样品的性能，并且使用较小颗粒（直径为10μm）的组装样品的性能在100μm×80μm中具有更高的可重复性。垫尺寸。与具有焊料凸点的硅样品相比，在20 GHz以下的插入损耗差异小于0.25 dB。因此，磁对准的ACA有望成为焊盘尺寸小于100μm的高频应用的有前途的替代产品。窄间距。

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