Thermal Stress Analysis in a Multilayer Power Module

著录项

• 来源
  《IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain》|2008年|p.001134-001140|共7页
• 会议地点 Providence RI(US);Providence RI(US)
• 作者

  R. K. Rajgarhia; B. McPherson; J. Hornberger; A. B. Lostetter; A. Saxena;

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• 作者单位

  Arkansas Power Electronics International, Inc., 535 W. Research Center Blvd. Suite 209, Fayetteville, AR, 72701 Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR, 72701;

  Arkansas Power Electronics International, Inc., 535 W. Research Center Blvd. Suite 209, Fayetteville, AR, 72701 Phone: 479-443-5759, Email: bmcpher@apei.net;

  Arkansas Power Electronics International, Inc., 535 W. Research Center Blvd. Suite 209, Fayetteville, AR, 72701;

  Arkansas Power Electronics International, Inc., 535 W. Research Center Blvd. Suite 209, Fayetteville, AR, 72701;

  Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR, 72701;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 微电子学、集成电路（IC）;
• 关键词

  high temperature power electronics; high temperature packaging; thermal stress;

  机译：高温电力电子设备；高温包装；热应力;