Electrical and Mechanical Properties of Carbon Nanotube Filled Adhesives on Lead Free PCB Surface Finishes

著录项

• 来源
  《IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain》|2008年|p.001075-001081|共7页
• 会议地点 Providence RI(US);Providence RI(US)
• 作者

  Keerthivarma Mantena; Janet K. Lumpp; Naveen Velicheti; Midhun Jasti; Poojitha Sirigiri;

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• 作者单位

  Department of Electrical and Computer Engineering, University of Kentucky 453 F. Paul Anderson Tower, Lexington, KY 40506-0046;

  rnDepartment of Electrical and Computer Engineering, University of Kentucky 453 F. Paul Anderson Tower, Lexington, KY 40506-0046 Phone: (859)257-4985, FAX: (859)257-3092, E-mail: jklumpp@uky.edu;

  rnDepartment of Electrical and Computer Engineering, University of Kentucky 453 F. Paul Anderson Tower, Lexington, KY 40506-0046;

  rnDepartment of Electrical and Computer Engineering, University of Kentucky 453 F. Paul Anderson Tower, Lexington, KY 40506-0046;

  rnDepartment of Electrical and Computer Engineering, University of Kentucky 453 F. Paul Anderson Tower, Lexington, KY 40506-0046;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 微电子学、集成电路（IC）;
• 关键词