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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >Process Integrated Quality Control (PiQC?) for Wire Bonding
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Process Integrated Quality Control (PiQC?) for Wire Bonding

机译：用于引线键合的过程集成质量控制（PiQC？）

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摘要

As costs of field failures keep increasing in many fields of electronic applications (e.g. automotive callbacks), achievement of zero failure rates of the goods delivered to the end user becomes an imperative goal to pursue. Current methods of monitoring wire bond quality for both heavy and. fine wire applications, however, fall short of finding 100% of all failure modes as they don't monitor every aspect of every wire bond connection. A major reason for this deficiency is that most QC systems only monitor wire deformation and/or use ultrasonic current as a signal to conclude bond quality. "Normal" wire deformation and current characteristics do not guarantee good bond quality in every case. Because different types of bond failures affect the available signals in different degrees, it becomes important to monitor all of them to get a wide decision base. A newly introduced multi-dimensional process integrated quality control (PiQC?) system now offers the capability to monitor a multitude of significant bonding process values for comprehensive wire inspection in achieving 100% quality control in real-time.
机译：随着现场故障成本在电子应用的许多领域（例如，汽车回电）中不断增加，实现向最终用户交付的商品的零故障率成为追求目标。监视重焊和重焊焊线质量的当前方法。但是，细线应用无法找到所有故障模式的100％，因为它们无法监控每个引线键合连接的每个方面。造成这种缺陷的主要原因是，大多数QC系统仅监视导线变形和/或使用超声电流作为信号来推断键合质量。在任何情况下，“正常”的导线变形和电流特性均不能保证良好的键合质量。由于不同类型的键合失败会在不同程度上影响可用信号，因此监视所有信号以获取广泛的决策基础变得很重要。现在，新引入的多维过程集成质量控制（PiQC？）系统可以监视大量重要的键合过程值，以进行全面的导线检查，从而实时实现100％的质量控制。

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