• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >A Comparison Study on SnAgNiCo and Sn3.8Ag0.7CuC5 Lead Free Solder System
【24h】

A Comparison Study on SnAgNiCo and Sn3.8Ag0.7CuC5 Lead Free Solder System

机译：SnAgNiCo和Sn3.8Ag0.7CuC5无铅焊料体系的比较研究

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

A study was conducted on BGA lead-free C5 solder joint system to compare SnAgNiCo versusrnconventional Sn3.8Ag0.7Cu solder alloy. This study showed that SnAgNiCo C5 solder systemrnperformed better than Sn3.8Ag0.7Cu in terms of joint strength and brittle mode failure. Shear andrnpull strength was measured by Dage which is representative of the intermetallic (IMC) strengthrnbetween the C5 solder sphere and Cu/Ni/Au pad finishing. Tray drop test and packing drop testrnwere done to gauge solder joint performance against handling and impact force. Arncomprehensive study was done to study the effect of microstructure and interface intermetallics ofrnboth solder system after assembly, after test, after high temperature storage (HTS) at 150℃ forrn168 hours and 504 hours and after 6x reflow towards the joint integrity. Microstructure studies onrnSnAgNiCo solder reveals that formation of rod shape Ag_3Sn IMC distributed across the solderrnsurface helps to act as dispersion hardening that increases the mechanical strength for thernSnAgNiCo solder after thermal aging. EDX analysis confirmed that in SnAgCu solder/Ni interface,rnCu-rich IMC formed on top of the Ni-rich IMC. For SnAgNiCo system, only Ni-rich IMC is found.rnTherefore, it is highly suspected that the presence of Cu-rich IMC posed a detrimental effect onrnthe joint strength and tends to cause brittle joint failure. Both of the effect is then showed in ballrnpull result that after 6x reflow, SnAgCu solder has 100% brittle mode failure, where SnAgNiCornsolder has only 5%. This result correlates with missing ball responses after packing drop tests.rnThus, SnAgNiCo lead-free solder is a potential candidate for lead-free solder joint improvementrnfor overall lead-free package robustness.
机译：对BGA无铅C5焊点系统进行了研究，以比较SnAgNiCo与常规Sn3.8Ag0.7Cu焊料合金。这项研究表明，SnAgNiCo C5焊料系统在接头强度和脆性模式失效方面均优于Sn3.8Ag0.7Cu。剪切强度和拉拔强度通过Dage测量，该强度代表C5焊料球与Cu / Ni / Au焊盘表面之间的金属间（IMC）强度。进行了托盘跌落测试和填料跌落测试，以测量焊点性能与处理力和冲击力之间的关系。进行了全面的研究，研究了组装后，测试后，在150℃下高温储存（HTS）168小时和504小时以及6次回流对接头完整性的影响后，两种焊料系统的微结构和界面金属间化合物的影响。对rnSnAgNiCo焊料的微观结构研究表明，形成分布在整个焊料表面的棒状Ag_3Sn IMC有助于分散硬化，从而提高了热老化后rnSnAgNiCo焊料的机械强度。 EDX分析证实，在SnAgCu焊料/ Ni界面中，在富含Ni的IMC的顶部形成了富含Cu的IMC。对于SnAgNiCo系统，只发现了富Ni的IMC。因此，高度怀疑富Cu的IMC会对接头强度产生不利影响，并易于引起脆性接头破坏。球形拉力结果显示了这两种效果，即经过6次回流后，SnAgCu焊料具有100％的脆性模式失效，而SnAgNiCornsolder仅具有5％的脆性模式失效。该结果与在包装跌落测试后遗漏的焊球响应有关。因此，SnAgNiCo无铅焊料可能是无铅焊点改进的潜在候选者，以提高整体无铅封装的坚固性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号