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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Reliability of Gold Wire Bond Interconnects in High Temperature (450°C), High Sheer Force (14,500 G) Applications
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Reliability of Gold Wire Bond Interconnects in High Temperature (450°C), High Sheer Force (14,500 G) Applications

机译：金线键合互连在高温（450°C），高剪切力（14,500 G）应用中的可靠性

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Researchers at Arkansas Power Electronics International, Inc. are developing and testing packaging technologies that will allow silicon carbide devices to be used to their full potential in extreme operating environments. The present work describes the testing of small diameter (0.7 mil and 1 mil) gold wire bond interconnects for use in high temperature (450°C) under parallel and perpendicular sheer forces to nearly 14,500G’s. rnSeveral wedge bonds were performed using a K&S 4523 semi-automatic wedge bonder onto thin-film gold and thick-film gold substrates. The wire bond settings (ultra sonic power, time, and force) were optimized for each wire diameter on each substrate. The bond strengths were optimized using the Dage 4000 vertical pull test. Each test board consisted of 180 wire bonds of varying length in the parallel direction and 165 wire bonds of varying length in the perpendicular direction. Two additional thick-film boards were produced with several wire bonded dummy die in order to test the wire bonds in a more realistic situation. All test boards were attached to gold packages. rnThe test setup consisted of a heated spin arbor with the electronic housing at a radius of 5.67”. The speed was increased to 8621rpm (11,962 G’s) over 8 minutes. The temperature was increased to 450°C over at least 15 minutes. After reaching 450°C, the speed was cycled from 8621rpm to low spin speeds (500-1000rpm) 10 times with transient times of 8 minutes. The speed was then cycled from low spin speeds to 9483 rpm (14,470 G’s) 10 times with transient times of 8 minutes.rn The analysis of the wire bonds consisted of SEM imaging before and after to determine extent of plastic deformation. Destructive vertical pull tests were also performed after the spin test to compare pull strengths between spun and control boards.
机译：阿肯色州电力电子国际有限公司的研究人员正在开发和测试封装技术，这些技术将使碳化硅器件在极端的工作环境中得到充分利用。本工作描述了在高温（450°C）下在平行和垂直剪切力达到近14,500G的情况下测试小直径（0.7密耳和1密耳）金线键合互连的测试。 rn使用K＆S 4523半自动楔形键合机在薄膜金和厚膜金基材上进行了几次楔形键合。针对每个基板上的每个导线直径，对导线键合设置（超音波功率，时间和力）进行了优化。使用Dage 4000垂直拉力测试优化了粘结强度。每个测试板由在平行方向上长度可变的180个引线键合和在垂直方向上长度可变的165个引线键合组成。为了在更现实的情况下测试引线键合，还生产了另外两个带有多个引线键合的虚拟管芯的厚膜板。所有测试板均附有金包装。 rn测试设置包括加热的旋转心轴，电子外壳的半径为5.67英寸。在8分钟内，速度提高到了8621rpm（11,962 G's）。在至少15分钟内将温度升至450℃。在达到450℃之后，将速度从8621rpm循环至低旋转速度（500-1000rpm）10次，过渡时间为8分钟。然后将速度从低速旋转到9483 rpm（14,470 G's）进行10次循环，过渡时间为8分钟。rn焊线的分析由SEM成像前后确定塑性变形程度组成。在旋转测试之后还进行了破坏性的垂直拉力测试，以比较旋转板和控制板之间的拉力强度。

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