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Welding Induced Alignment Distortion in Dual-in-Line LD Packages

机译:双列直插式封装中的焊接引起的对准畸变

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The tolerance for the movement of a single mode fiber relative to the laser is extremely tight,a submicron movement can often lead to a significant misalignment and thus the reduction in the power coupled into the fiber. Among various fiber pigtailing assembly technologies,pulsed laser welding is the method with submicron accuracy and is most conducive to automation. However,the meltingsolidification process during laser welding can often distort the pre-achieved fiber-optic alignment. This Welding-Induced-Alignment-Distortion (WIAD) is a serious concern and significantly affects the yield for single mode fiber pigtailing to a semiconductor laser. In this paper,effect of laser welding sequence on WIAD in a dual-in-line packager is numerically investigated by means of Finite Element Method (FEM). Optimal welding sequence may minimize WIAD in dual-in-line package. Additionally,unsymmetrical space between fiber and U-channel induced by laser welding of U-channel–to-plate in DIP LD packages is found to have obvious effect on WIAD.
机译:单模光纤相对于激光器运动的公差非常严格,亚微米运动通常会导致严重的未对准,从而降低耦合到光纤中的功率。在各种光纤尾纤组装技术中,脉冲激光焊接是一种亚微米精度的方法,最有利于自动化。然而,激光焊接过程中的熔化凝固过程通常会扭曲预先实现的光纤排列。这种焊接引起的对准畸变(WIAD)引起了人们的严重关注,并严重影响了半导体激光器的单模光纤尾纤的成品率。本文通过有限元方法(FEM),对双列直插式包装机中激光焊接顺序对WIAD的影响进行了数值研究。最佳焊接顺序可以使双列直插式封装中的WIAD最小化。此外,发现在DIP LD封装中,U形通道到板的激光焊接会引起光纤和U形通道之间的不对称空间,对WIAD有明显的影响。

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