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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Surface Finish of Substrate BGA Pad Effect on Flip Chip Ball Grid Array Package Solder Joint Reliability
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Surface Finish of Substrate BGA Pad Effect on Flip Chip Ball Grid Array Package Solder Joint Reliability

机译：基板BGA焊盘的表面光洁度对倒装芯片球栅阵列封装焊点可靠性的影响

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摘要

Solder joint reliability is one of the most critical issues for successful application of Ball Grid Array (BGA) Package in electronic industry. Flip chip package technologies currently attract increasing attention from the electronics packaging industry. Intensive studies have been performed on both component level and board level reliability. However,board level reliability of flip chip BGA for large die and packages is still limited. At the same time,different application may prefer different surface finish depending on cost and product life cycle etc. In order to understand the mechanism of different surface finish effect on flip chip BGA packages board level reliability,five different kinds of BGA ball pad surface finish (Cu/SOP,Cu/OSP,ENIG,ENEPIG and Electrolytic Ni/Au) were studied in this paper. Package with Large die and body size was used as test vehicle in this study. The results reveal that Electrolytic Ni/Au,ENIG and ENEPIG have comparable board level reliability which is better than Cu/OSP and Cu/SOP. It also confirms that the ENIG brittle failure is “infant mortality” failure. Packages with ENIG surface finish is generally having satisfactory long term solder joint reliability.
机译：焊点可靠性是成功将球栅阵列（BGA）封装应用于电子行业的最关键问题之一。倒装芯片封装技术目前吸引了电子封装行业的越来越多的关注。在组件级和板级可靠性方面都进行了深入研究。然而，倒装芯片BGA在大芯片和封装中的板级可靠性仍然受到限制。同时，不同的应用可能会根据成本和产品生命周期等因素选择不同的表面光洁度。为了了解不同表面光洁度对倒装芯片BGA封装板级可靠性的影响机理，五种不同种类的BGA球垫表面光洁度本文研究了Cu / SOP，Cu / OSP，ENIG，ENEPIG和电解Ni / Au。在这项研究中，使用具有大模具和小尺寸的包装作为测试工具。结果表明，电解Ni / Au，ENIG和ENEPIG具有可比的板级可靠性，优于Cu / OSP和Cu / SOP。它还证实了ENIG脆性破坏是“婴儿死亡率”破坏。具有ENIG表面光洁度的封装通常具有令人满意的长期焊点可靠性。

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